06/02/2015  CEA-Leti today announced that it has demonstrated a path to fabricating high-density micro-LED arrays for the next generation of wearable and nomadic systems in a process that is scalable to the IC manufacturing process.

05/29/2015  The 17th annual LetiDays Grenoble on June 24-25 will expand the conversation with presentations about Internet of Things-augmented mobility, which is revolutionizing the way we interact with appliances, infrastructure and countless common objects that are part of our daily lives.

05/29/2015  IC Insights has downgraded its forecast for the overall personal computing market, including much lower growth in tablets and continued weakness in standard PCs.

05/26/2015  Xcerra Corporation today announced that Nordic Semiconductor, a company that specializes in ultra-low power (ULP) 2.4GHz transceivers, notably for the Bluetooth Smart and wearables segments, has selected the Diamondx from Xcerra's semiconductor tester group, LTX-Credence, for high volume production test of their Internet of Things (IoT) products.

05/21/2015  Ever growing volumes of data to be stored and accessed, and advancing process technologies for sophisticated control of deposition and etch in complex stacks of new materials, are creating a window of opportunity for an emerging variety of next-generation non-volatile memory technologies.

05/19/2015  Newly launched center assisting customers in developing products and applications in photonics; leads to multiple system orders.

05/19/2015  In 2014, the MEMS sector represented an $11.1B business for Si-based devices. According to Yole Développement (Yole) latest MEMS report “Status of the MEMS Industry”, the MEMS industry is preparing to exceed $20B by 2020.

05/19/2015  Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

05/15/2015  SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.

05/14/2015  MEMS Industry Group (MIG), the trade association advancing micro-electromechanical systems (MEMS) and sensors across global markets, today announced the creation of a new TSensors division headed by TSensors Summit, Inc.

05/14/2015  There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases.

05/14/2015  Freescale Semiconductor today introduced its Intelligent Sensing Framework (ISF) 2.1, which now includes integration with Freescale’s Processor Expert tool to help create, configure, and generate embedded sensor-based applications for Freescale microcontrollers (MCUs).

05/13/2015  Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm.

05/12/2015  Intel Corporation today announced plans to develop integrated products with eASIC Corporation that combine processing performance and customizable hardware to meet the increasing demand for custom compute solutions for data centers and the "cloud."

05/12/2015  Samsung Electronics Co., Ltd. today announced the Samsung ARTIK platform to allow faster, simpler development of new enterprise, industrial and consumer applications for the Internet of Things (IoT).

05/12/2015  IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

05/12/2015  The paper submission deadline is Monday, June 22, 2015 at 23:59 p.m. Pacific Time.

05/12/2015  Researchers have demonstrated pattern recognition using a magnonic holographic memory device.

05/12/2015  By combining 3D holographic lithography and 2D photolithography, researchers from the University of Illinois at Urbana-Champaign have demonstrated a high-performance 3D microbattery suitable for large-scale on-chip integration with microelectronic devices.

05/11/2015  To date, chip-based retinal implants have only permitted a rudimentary restoration of vision. However, modifying the electrical signals emitted by the implants could change that.