08/01/2018  Keysight MX0100A InfiniiMax micro probe head designed to access small geometry, high density target devices.

07/30/2018  A new way of arranging advanced computer components called memristors on a chip could enable them to be used for general computing, which could cut energy consumption by a factor of 100.

07/30/2018  Imec, a research and innovation hub in nanoelectronics and digital technologies, announces that Niels Verellen, one of its young scientists, has been awarded an ERC Starting Grant.

07/27/2018  Researchers at the National Institute of Standards and Technology (NIST) have made a silicon chip that distributes optical signals precisely across a miniature brain-like grid, showcasing a potential new design for neural networks.

07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

07/25/2018  TheXcerra MT2168 XT pick-and-place handler was installed for a tri-temp module test application at a major player in global semiconductor manufacturing.

07/24/2018  Millimeter-scale chip uses less power to create quantum random numbers at high speeds.

07/24/2018  Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.

07/23/2018  Park Systems announced the opening of the Park Nanoscience Lab at the prestigious Indian Institute of Science (IISC) Bangalore India, which has been upgraded to the status of Institute of Eminence.

07/23/2018  Toshiba Memory will start to deliver samples to SSD and SSD controller manufacturers for evaluation from the beginning of September, and expects to start mass production in 2019.

07/23/2018  Scientists have perfected a technique to exceed capacity of current hard drives 1000-fold.

07/20/2018  A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

07/20/2018  Optical training of neural networks could lead to more efficient artificial intelligence.

07/20/2018  The Japan semiconductor manufacturing supply chain is a global semiconductor industry workhorse, producing about one third of world's chip equipment and more than half of its semiconductor materials.

07/17/2018  Researchers at Purdue University and the University of Virginia have developed a new fabrication method that makes tiny, thin-film electronic circuits peelable from a surface. The technique not only eliminates several manufacturing steps and the associated costs, but also allows any object to sense its environment or be controlled through the application of a high-tech sticker.

07/16/2018  Daniel Cooley has been named Senior Vice President and Chief Strategy Officer.

07/16/2018  A team of researchers from the Centre of Excellence for Quantum Computation and Communication Technology (CQC2T) at UNSW Sydney have successfully implemented an atomic engineering strategy for individually addressing closely spaced spin qubits in silicon.

07/16/2018  Boston Semi Equipment (BSE) introduced today its Zeus gravity feed solution for handling pressure MEMS devices that require pressure and vacuum stimulus during testing.

07/13/2018  Dr. LI Jiafang, from the Institute of Physics, Chinese Academy of Sciences, has recently formed an international team to apply kirigami techniques to advanced 3D nanofabrication.

07/13/2018  Broadcom Inc. and CA Technologies today announced that the companies have entered into a definitive agreement under which Broadcom has agreed to acquire CA to build one of the world's leading infrastructure technology companies.