MEMS

MEMS ARTICLES



STMicroelectronics unveils highly integrated mobile-security chip

09/27/2018  STMicroelectronics revealed its highly integrated mobile-security solution, the ST54J, a system-on-chip (SoC) containing an NFC (Near-Field Communication) controller, Secure Element, and eSIM.

U.S.-China trade war heats up with semiconductor industry caught in the middle

09/25/2018  Earlier this week, the U.S. Trade Representative (USTR) released a 10 percent tariff on $200 billion in imports from China, including more than 90 tariff lines central to the semiconductor industry.

Smaller, faster and more efficient modulator sets to revolutionize optoelectronic industry

09/24/2018  A research team comprising members from City University of Hong Kong (CityU), Harvard University and renowned information technologies laboratory has successfully fabricated a tiny on-chip lithium niobate modulator, an essential component for the optoelectronic industry.

STMicroelectronics and Leti develop GaN-on-silicon technology for power conversion applications

09/24/2018  STMicroelectronics and Leti, a research institute of CEA Tech, today announced their cooperation to industrialize GaN (Gallium Nitride)-on-Silicon technologies for power switching devices.

Leti announces EU project to develop powerful, inexpensive sensors with photonic integrated circuits

09/19/2018  Leti, a research institute of CEA Tech, today announced the launch of the REDFINCH consortium to develop the next generation of miniaturized, portable optical sensors for chemical detection in both gases and liquids.

FLEX/MSTC 2019 Call for Papers deadline is September 28, 2018

09/19/2018  Educate the industry with the latest in flexible, hybrid and printed electronic innovations OR sensor systems enabling autonomous mobility.

Leti and EFI launch project to improve reliability and speed of low-cost electronic devices for autos

09/18/2018  Leti, a research institute of CEA Tech, and EFI Automotive, an international supplier of sensors, actuators and embedded smart modules for the automotive industry, today announced a project to dramatically improve reliability and response time of low-cost automotive components by equipping the devices with sophisticated model predictive control techniques.

Seven IC products to outpace total 16% IC market growth in 2018

09/18/2018  13 IC products forecast to show double-digit growth, led by a 39% surge in DRAM sales.

Open-Silicon appoints new VP of Engineering

09/18/2018  Anand Bariya brings 25 years of engineering management experience to custom silicon solution provider.

The role of autonomous mobility in driving MEMS & sensors to $100B market

09/13/2018  MEMS & Sensors Executive Congress speakers to provide insights into enabling connected devices for wearables, robotics, cars, and autonomous applications October 29-30 in Napa Valley, Calif.

Sensors: From red hot chillies to patients

09/13/2018  SEMI's Serena Brischetto caught up with Zimmer and Peacock Director Martin Peacock to discuss sensor opportunities and challenges ahead of the European MEMS & Sensors and Imaging & Sensors Summits.

Wearable ultrasound patch monitors blood pressure deep inside body

09/12/2018  A new wearable ultrasound patch that non-invasively monitors blood pressure in arteries deep beneath the skin could help people detect cardiovascular problems earlier on and with greater precision.

"Dreams Start Here" at SEMICON Japan 2018 in era of AI

09/11/2018  Japan is at the heart of the semiconductor industry as the era of artificial intelligence (AI) dawns. SEMICON Japan 2018 will highlight AI and SMART technologies in Japan's industry-leading event.

More than mobility: Smart automotive innovations go beyond technology

09/10/2018  Are you ready for a shared economy where your transportation needs are no longer met by an automaker, but rather a "mobility service provider"?

Sensor fusion: Enabling devices to be aware of their surroundings

09/07/2018  SEMI spoke with Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG, ahead of the European MEMS & Sensors Summit.

The future of MEMS and sensors: Beyond human senses

09/06/2018  2017 was a good year for the MEMS and sensors business, and that upward trend should continue.

Less price erosion will lift MEMS sensor/actuator growth

09/05/2018  More intelligent and automated controls and specialized MEMS-built semiconductors will keep ASPs from falling as much as they did in the last 10 years, says O-S-D report.

Leti and Vsora demonstrate 3GPP new radio on multi-core digital signal processor

09/04/2018  Leti, a research institute of CEA Tech, and VSORA, which specializes in multi-core digital signal processor (DSP) design, today announced they have demonstrated the implementation of 5G New Radio (5G NR) Release 15 on a new DSP architecture that can dramatically reduce time to market of digital modems.

SEMICON Taiwan opens with AI, IoT, automotive in the spotlight

09/04/2018  Semiconductor industry growth drivers artificial intelligence (AI), Internet of Things (IoT) and automotive take center stage as more than 45,000 visitors gather at SEMICON Taiwan starting today.

NXP acquires OmniPHY

09/04/2018  NXP Semiconductors N.V., the world's largest supplier of automotive semiconductors, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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