Metrology

METROLOGY ARTICLES



Making the most of color in your multi-patterning layouts

03/28/2018  There are many different situations in which special attention to color choices provide the potential to improve the manufacturing results of multi-patterned masks.

Improving human-data interaction to speed nanomaterials innovation

03/26/2018  New application of data analysis, visualization techniques achieves better representation of multidimensional materials data; Work is part of Lehigh University's initiative to accelerate understanding of materials through improved human-data interaction

Semiconductor Industry Association issues statement on Trump administration Section 301 action on China

03/23/2018  The Semiconductor Industry Association (SIA) today released the following statement from President & CEO John Neuffer in response to the Section 301 action taken by the Trump Administration to address China's trade practices.

North American semiconductor equipment industry posts February 2018 billings

03/23/2018  February billings remain at a level indicating another positive year for semiconductor equipment spending.

Mechanism and improvements of Cu voids under via bottom

03/22/2018  This work explores the effect of underlying metallic alloys and the influence of Cu loss under via bottom after dry etching and wet cleaning processes. To Improve the Cu loss under via bottom, effective approaches are proposed. The modified actions for via bottom improve not only wafer yield but also reliability of the device.

U.S. trade tensions with China hit fever pitch

03/21/2018  Stiff tariffs and the dismantling of longstanding trade agreements – cornerstones of these new actions – will ripple through the semiconductor industry with particularly damaging effect.

SEMICON West 2018 to spotlight smart technologies, workforce development

03/20/2018  SEMICON West has opened registration for the July 10-12, 2018, exposition at the Moscone Center in San Francisco, California.

The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

IC Insights raises 2018 IC market forecast from 8% to 15%

03/15/2018  Increased expectations for the DRAM and NAND flash markets spur upward revision.

Researchers develop spectroscopic thermometer for nanomaterials

03/13/2018  A scientific team led by the Department of Energy's Oak Ridge National Laboratory has found a new way to take the local temperature of a material from an area about a billionth of a meter wide, or approximately 100,000 times thinner than a human hair.

Fab spending poised for remarkable fourth year of growth

03/12/2018  The latest update to the SEMI World Fab Forecast report, published on February 28, 2018, reveals fab equipment spending will increase at 5 percent in 2019 for a remarkable fourth consecutive year of growth.

January semiconductor sales up 22.7% compared to last year

03/06/2018  Global semiconductor market grows year-to-year for the 18th consecutive month; month-to-month sales decrease slightly.

HEIDENHAIN donates to UNCC Center for precision metrology

03/05/2018  Enabling further advancements in metrology, HEIDENHAIN CORPORATION recently donated some equipment to UNC Charlotte's Center for Precision Metrology (CPM), a world premier university metrology lab.

Executive viewpoints: 2018 outlook

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

Work to do to keep the good times rolling

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages

03/01/2018  3D integration and packaging has challenged failure analysis (FA) techniques and workflows due to the high complexity of multichip architectures, the large variety of materials, and small form factors in highly miniaturized devices.

Top semiconductor metrology/inspection equipment vendors continue to increase share of total market

02/27/2018  The top five semiconductor metrology/inspection equipment vendors grew 17.7% in 2017 according to the report “Metrology, Inspection, and Process Control in VLSI Manufacturing”, recently published by The Information Network.

North American semiconductor equipment industry posts January 2018 billings

02/23/2018  "The strong billings levels from late 2017 have carried over into the new year," said Ajit Manocha, president and CEO of SEMI.

Supermicro expands its Silicon Valley corporate headquarters

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

Entering 2018 on solid ground

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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