Metrology

METROLOGY ARTICLES



Moore's Law has stopped at 28nm

03/05/2014  While many have recently predicted the imminent demise of Moore’s Law, we need to recognize that this actually has happened at 28nm.

Busch Vacuum Pumps and Systems joins F450C Consortium

03/04/2014  The Facilities 450mm Consortium (F450C), a partnership of nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced Busch Vacuum Pumps and Systems as the eleventh member company to join the consortium.

Global semiconductor industry posts highest-ever January sales

03/03/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $26.28 billion for the month of January 2014, an increase of 8.8 percent from January 2013 when sales were $24.15 billion, marking the industry's highest-ever January sales total and the largest year-to-year increase in nearly three years.

New SEMICON Europa in Grenoble to emphasize innovation and applications

03/03/2014  SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

02/26/2014  GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

02/21/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Semiconductor industry posts record sales in 2013

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

The most expensive SRAM in the world - 2.0

02/20/2014  Embedded SRAM scaling is broken and, with it, Moore's Law.

Honeywell introduces new copper manganese sputtering targets

02/14/2014  Honeywell announced today that it has introduced new copper manganese (CuMn) sputtering targets for semiconductor manufacturing based on patented technology offering customers higher strength, longer life, and better performance.

Rudolph announces shipments for 3D metrology of TSVs

02/11/2014  Rudolph Technologies, Inc. announced today the sale of its first NSX 320 TSV Metrology System to CEA-Leti, a research organization based in Grenoble, France.

Silicon wafer revenues decline in 2013

02/11/2014  Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

02/07/2014  The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

02/07/2014  Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

Silicon reclaim wafer market increased 14% in 2013

02/06/2014  The worldwide reclaim wafer market is estimated at $460 million in 2013 and is forecasted to reach $493 million by 2015, according to SEMI.

Entegris to acquire ATMI

02/04/2014  Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

2014 capital spending up in Korea; SEMICON Korea to address mobile innovation

01/31/2014  With Korea expected to be the second largest region for fab construction spending in 2014, industry leaders will convene at SEMICON Korea 2014 in Seoul on February 12-14 to discuss the latest trends and technologies shaping the future of microelectronics manufacturing.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

01/27/2014  Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

SMIC unveils 28nm readiness

01/27/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.

Europe leaders to examine EC’s ambitious goal

01/27/2014  At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

Book-to-bill ratio continues to improve

01/24/2014  The December three-month average bookings were at the highest level since June 2012 — a positive sign for the 2014 spending outlook.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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