06/04/2013 

Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.

06/03/2013 

In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.

05/31/2013 

At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.

05/21/2013 

Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.

05/18/2013  I have said many times that it will be impossible for a complicated technology like 3DIC to ever become commercial without standardization.

05/14/2013 

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

05/09/2013 

While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.

05/08/2013 

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.

04/29/2013 

SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.

04/29/2013 

Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.

04/29/2013 

Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.

04/29/2013 

Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.

04/29/2013 

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

04/26/2013 

Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”

04/23/2013 

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.

04/19/2013 

The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?

04/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.

04/18/2013  The IC fabrication industry is approaching the end of the road for device miniaturization, with both atomic and economic limits looming on the horizon.

04/16/2013 

Error correction code and redundant addresses are both techniques well-known in memories as a way of optimizing yield. But new data from the University of Ferrara shows that these common techniques may be overused. By classifying erratic bits more carefully, it’s possible to use less ECC and up to 35 percent less redundancy.

04/16/2013 

The ability of a resistive RAM device to maintain its resistance state, otherwise known as retention time, can be impacted by the electrode materials used.