Metrology

METROLOGY ARTICLES



A single European semiconductor strategy is on its way

02/28/2013 

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.

New Product: KLA-Tencor announces two new litho/etch process control tools

02/26/2013 

New metrology and inspection products facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips.

SEMATECH’s Bryan Rice named 2013 SPIE Fellow

02/26/2013  SEMATECH announced today that Dr. Bryan J. Rice, on assignment from Intel Corporation as SEMATECH’s director of Strategic Initiatives, was inducted as a 2013 Fellow by SPIE, the international society for optics and photonics, during its annual SPIE Advanced Lithography conferences in San Francisco, CA.

DNP and Luminescent Technologies achieve milestone in development of metrology and inspection program

02/25/2013 

Luminescent Technologies Inc., a provider of computational metrology and inspection solutions for the global semiconductor manufacturing industry, and Dai Nippon Printing Company, Ltd. announced today the successful completion of the first phase of a three-year joint development program for computational metrology and inspection using Luminescent’s Automated Image Processing Hub (LAIPH) platform.

SPIE Advanced Lithography will bring industry focus to next-generation tools and systems

02/19/2013 

SPIE Advanced Lithography, the annual forum for discussions on state-of-the-art lithographic tools, resists, metrology, materials characterization, and design and process integration, will bring the community together in San Jose, California, next week to address those challenges.

SEMATECH to demonstrate advances and technical breakthroughs at SPIE 2013

02/19/2013 

Papers showcase EUV extendibility and metrology techniques for defect inspection and 3D TSVs.

Silicon wafer revenues decline in 2012

02/12/2013 

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

Econometric Forecast: Semiconductor growth should recover by 2014

02/08/2013 

In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.

Econometric Forecast: Regional developments to affect growth of semiconductor industry

02/07/2013 

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.

Econometric forecasting service predicts 6% growth in semiconductor wafers in 2013

02/07/2013 

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.

Looking for an integrated post-tapeout flow

02/06/2013 

Dr. Steffen Schulz discusses the role of a flexible platform for computational lithography in a successful business strategy.

Semiconductor R&D spending rises 7% despite weak market

02/05/2013 

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.

KLA-Tencor announces new e-beam inspection system

01/30/2013 

KLA-Tencor Corporation (NASDAQ: KLAC) announced the eS805, a new electron-beam inspection system capable of detecting very small defects, and defects that cause electrical problems.

1/f noise measurement system unveiled

01/29/2013 

ProPlus Design Solutions announced it is shipping a new wafer-level, 1/f noise measurement system. Increasingly, circuit designers are interested in 1/f noise data at higher frequencies.

Process Watch: Exploring the dark side

01/25/2013 

A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.

IBM team wins Feynman Prize for scanning probe microscopy

01/17/2013 

IBM Researchers won the prestigious Feynman prize given by the Foresight Group. The team was the first to produce images detailed enough to identify the structure of individual molecules, as well as metal-molecule complexes.

GlobalFoundries adding R&D facility to NY fab campus

01/11/2013 

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."

SEMI approves first HB-LED standards

01/09/2013 

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.

2013: Advanced chemistry moves center stage

01/04/2013 

We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.

IDC: Semiconductor revenues will grow 4.9% in 2013

01/04/2013 

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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