11/12/2012 

Quartz Imaging Corp., Vancouver, BC, Canada, will be showing its newest FA-LIMS system (failure analysis laboratory information system) at the International Symposium for Testing & Failure Analysis.

11/12/2012 

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.

11/01/2012 

A group of partners in Europe summarize results from their completed project to deliver the first EUV lithography optics, with progress in several optics components and in mask handling, cleaning, and repair.

10/22/2012 

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.

10/19/2012 

In the fifth installment in a series called Process Watch, the authors discuss the need for proper reticle cleaning and inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

10/18/2012 

At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.

10/17/2012 

Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.

10/16/2012 

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

10/09/2012 

EUV Symposium host imec and a pair of industry analysts gauge the pace of improvements in EUV lithography and its long march toward production readiness.

10/08/2012 

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

10/04/2012 

Fab equipment spending continues to soften in 2012, and hopes for a reprieve in 2013 are waning, warns one analyst.

09/27/2012 

ProPlus Design Solutions, Inc. unveiled NanoYield, yield prediction and optimization software for memory, logic, analog and digital circuit design.

09/26/2012 

During sessions at this month's SEMICON Taiwan, execs from TEL, Lam Research, Applied Materials and KLA-Tencor revealed the latest developments in 450mm technology.

09/21/2012 

Demand for chip tools fell again in August and is off by -30% from its peak in early summer, fulfilling fears that the second half of 2012 will be sluggish for chipmaking investments, according to the latest data from SEMI.

09/20/2012 

At this year’s International Electron Devices Meeting (IEDM), foundry TSMC will describe a heterogeneous epitaxial growth process which for the first time enables Ge to be directly grown on Si.

09/20/2012 

The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).

09/20/2012 

Researchers have begun to investigate a new 2D material—molybdenum sulfide (MoS)—which has similar characteristics but offers something graphene doesn’t: a wide energy bandgap, enabling transistors and circuits to be built from it directly.

09/20/2012 

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

09/20/2012 

In an invited paper at the International Electron Devices Meeting, researchers from Everspin Technologies will describe how they built the largest functional ST-MRAM circuit ever built, a 64-Mb device with good electrical characteristics.

09/20/2012 

At the International Electron Devices Meeting (IEDM) in December, a team led by IBM will report on the world’s first high-performance hybrid-channel ETSOI CMOS device.The researchers built a ring oscillator circuit to benchmark performance that worked even better than FinFETs.