Metrology

METROLOGY ARTICLES



Process Watch: Taming the overlay beast

09/18/2012 

In the fourth installment in a series called Process Watch, the authors discuss overlay registration and new capabilities to align to buried layers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

iPhone 5: Which semiconductor suppliers are the big winners?

09/14/2012 

As the dust settles after the launch of the iPhone 5, analysts tally which suppliers in the semiconductor ecosphere are most likely to gain the most.

NIST tips "hybrid" metrology method to test chips

09/13/2012 

The National Institute of Standards and Technology (NIST) says it's combined scanning techniques and statistical data to both more precisely and less expensively measure features on a chip -- and two big chip firms are already on board.

Chip tool demand slumps in 2Q12, though Taiwan shines

09/12/2012 

Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.

Waiting for the next "golden year"

09/07/2012 

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.

Rudolph wins order for advanced packaging metrology systems

09/06/2012 

An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.

SRC to host TECHCON conference in September

08/29/2012 

Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30th anniversary at its annual TECHCON conference Sept. 10-11.

FEI Launches Helios TEM sample prep platform

08/28/2012 

FEI announced two new Helios NanoLab systems, the 450HP and 1200HP DualBeam systems, which include new capability that meets the critical requirements for semiconductor process development at the 28nmdevice geometry node and below.

Brooks Automation updates vacuum monitoring equipment

08/28/2012 

Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.

SEMI builds portal for 450mm info

08/27/2012 

SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.

Dynamic changes impacting advanced electronic materials industry

08/22/2012 

Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.

Present on semiconductor metrology and more at ASMC 2013

08/22/2012 

ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.

FEI, Hitachi High-Tech settle focused ion beam patent dispute

08/21/2012 

FEI will pay $15M to settle the dispute over focused ion beam systems, in exchange for dropping litigation and cross-licensing FIB technologies.

DoD mandates DNA-based component counterfeiting protection measures

08/20/2012 

Applied DNA Sciences, a provider of DNA-based anti-counterfeiting and security solutions, was named by the DoD Defense Logistics Agency as the provider of authentication services for microcircuits supplied by defense contractors.

North American semiconductor fab tool orders tracked flat Y/Y in July

08/17/2012 

"Bookings and billings for North American semiconductor equipment in July are close to values reported exactly one year ago," said Denny McGuirk, SEMI, noting seasonally slow investment activity.

Bruker improves AFMs for semiconductor metrology with KPFM mode

08/14/2012 

Bruker released the PeakForce Kelvin Probe Force Microscopy mode for its AFMs. PeakForce KPFM improves quantitative surface potential data for semiconductor metrology and materials research.

Agilent

08/07/2012 

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.

Qcept sells NVD inspection tool for semiconductor process development and integration

08/06/2012 

A “leading semiconductor technology innovator” ordered Qcept Technologies Inc.’s ChemetriQ 5000 NVD inspection system for unit process development and process integration activities for advanced nodes, including 2Xnm and 1Xnm logic nodes for both front-end-of-line and back-end-of-line processes.

Rubicon orders Zeta 300 optical profilers for sapphire LED substrates

08/06/2012 

Zeta Instruments will install multiple optical profilers for micron-scale surface analysis at sapphire substrate maker Rubicon Technology, for metrology and inspection on sapphire substrates and wafer production aimed at the HB-LED market.

Process Watch: Bigger and better wafers

08/02/2012 

In the third installment in a series called Process Watch, the authors discuss some of the challenges of 450mm wafers. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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