Metrology

METROLOGY ARTICLES



The ConFab 2012: A retrospective

08/02/2012 

The ConFab, Solid State Technology’s invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldn’t be there, check out all the coverage from the event -- reports, presentations, video interviews and more.

EDAX debuts SDD series for faster electron microscopy without lost data

07/31/2012 

EDAX Inc. introduced the Octane Series silicon drift detectors (SDD) for its TEAM EDS Analysis Systems on electron microscopes.

FEI’s extreme-high-resolution SEM enables metrology on semiconductors <22nm

07/30/2012 

FEI (NASDAQ:FEIC) launched the Verios XHR SEM for metrology on beam-sensitive and sub-nanometer-scale materials in advanced semiconductors.

Majority of semiconductor manufacturing suppliers experience IP challenges

07/24/2012 

SEMI recently conducted a survey of semiconductor fab equipment and materials suppliers, finding that 60+% of respondents say that IP challenges have had an adverse impact on their companies.

Real-time monitoring slashes water and energy usage in semiconductor manufacturing on 300mm and 450mm wafers

07/23/2012 

SRC-sponsored researchers developed new sensor-based metrology technology that can significantly reduce water and related energy usage during semiconductor manufacturing.

Secondary semiconductor equipment: Turnkey services offer a fab-centric approach

07/23/2012 

RED Equipment’s Carl McMahon suggests a different model for handling secondary semiconductor equipment for greater efficiency, cost reduction and quality control: full turnkey services engineered to the fab’s needs without the expense of customization.

Semiconductor test terminology guide aims to clarify docking and handling ops

07/17/2012 

SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the

C-SAM acoustic micro imaging system meets budget-conscious lab inspection needs

07/17/2012 

Sonoscan unveiled its Lab Model 9600 C-SAM acoustic micro imaging system to serve laboratory/failure analysis applications and for use in low-volume semiconductor production inspection.

SEMICON West takeaways: Seasonality over cyclicality, lithography and test trends

07/16/2012 

SEMICON West kicked off with a surprise announcement regarding Intel's investment in ASML, but generally the event highlighted trends “as expected” in the fab supply chain, say Barclays analysts.

Bruker metrology suite debuts for 450mm semiconductor fab

07/13/2012 

Bruker introduced three 450mm X-ray and AFM semiconductor metrology tools -- the InSight-450 3DAFM, the D8 FABLINE X-ray system, and the S8 FABLINE-T X-ray system -- during SEMICON West.

2012 ITRS stabilized for front-end, but changes loom for 2013

07/13/2012 

The overriding message for 2012 is that the roadmap has been largely stabilized with the significant changes that were input last year in the 2012 publication,” said Intel’s Alan Allan, speaking at Semicon West.

Newport introduces 450mm air bearing stages

07/12/2012 

Newport Corporation introduced a line of high-performance air bearing stages specifically designed for the 450mm semiconductor wafer initiative.

Q3 semiconductor tool capex pull-back: Seasonal, expect Q4 uptick

07/12/2012 

Barclays Capital is seeing various reasons for a Q3 2012 semiconductor fab order/shipment pull-back, following meetings around SEMICON West 2012. The analysts expect strong orders in Q4.

Semiconductor fab tool capex trends gleaned @ SEMICON West

07/12/2012 

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.

Rudolph launches noncontact metal film metrology for FPD panels

07/11/2012 

Rudolph Technologies launched the MetaPULSE FP thin film metrology system with an initial sale to a major manufacturer of flat panel displays (FPD) for handheld mobile devices.

Jordan Valley Semiconductor's 450mm defect detection tool wins Best of West

07/11/2012 

Solid State Technology and SEMI announced the Best of West Award winner -- Jordan Valley Semiconductor -- during SEMICON West today. Jordan Valley Semiconductor’s QC-TT defect inspection system predicts breakage in 450mm wafers, which are subject to more handling steps and more thermal stresses due to their larger size.

Semiconductor equipment spending to contract 2.6% in 2012, grow in 2013

07/10/2012 

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.

Semicon West 2012 opens with semiconductor revenue forecasts, high-level perspectives

07/10/2012 

Michael A. Fury, Ph.D., reports from the pre-opening day (July 9) of SEMICON West at the Moscone Center in San Francisco, CA. The first day hosts SEMI’s press conference on semiconductor revenues and the SEMI/Gartner Market Symposium.

USHIO UV irradiance meter offers thin form factor for optical film process control

07/09/2012 

Ushio launched its thinnest UV irradiance meter 'UIT-q365." The meter is 4.9mm thick, used to keep major UV processes within spec. It can be used during optical film manufacturing for flexible electronics, as well as during adhesion of precision optical parts.

More SEMICON West exhibit previews

07/08/2012 

Following are some of the new and flagship products that will appear this week at SEMICON West, July 10-12 in the Moscone Center of San Francisco, CA.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts