07/06/2012 

We at Solid State Technology have compiled the best conference reports so far this year, in the lead up to SEMICON West 2012, next week in San Francisco.

07/04/2012 

The Semiconductor Industry Association (SIA) presented its 2012 University Researcher Awards to Stanford University professors Krishna Saraswat and Bruce Wooley as well as its 2012 Congressional Leadership Awards to Sen. Carl Levin, Sen. John McCain, Rep. Kevin Brady and Rep. Wally Herger.

06/29/2012 

The IDE Group developed the STC series of Active Vibration Isolation Systems supporting OEMs in the production of 450mm wafer equipment.

06/29/2012 

Maxim is spending $200 million to upgrade and expand its US semiconductor manufacturing facilities in San Antonio and Dallas, TX; Beaverton, OR; and San Jose, CA. Maxim manufactures about 50% of its products in the US.

06/28/2012 

Semiconductor manufacturers identified key factory productivity challenges that need to be addressed and shared effective solutions they will need to stay leading-edge and competitive amid turbulent industry transitions during the recent ISMI Manufacturing Week.

06/28/2012 

Following are some of the process control, device inspection, defect detection, and other metrology and test products that will be on display at SEMICON West 2012, July 10-12 in San Francisco, CA.

06/28/2012 

Solid State Technology and SEMI today announced the finalists for the 2012 “Best of West” awards, recognizing important product and technology developments in the microelectronics supply chain.

06/28/2012 

DFMSim announced a distribution agreement with a leading US process control OEM that involves the integration of DFMSim’s SMARTlitho manufacturing software into new tools for advanced metrology.

06/25/2012 

SEMATECH added Michael Lercel as senior director for nanodefectivity and metrology, taking the helm on SEMATECH’s ongoing semiconductor wafer metrology program and the new Nanodefect Center in NY.

06/24/2012 

Evans Analytical Group Inc. (EAG) added electron backscatter diffraction (EBSD) to its analytical and testing services.

06/22/2012 

Semiconductor manufacturers will spend $2.3 billion in 2012 for flow control and treatment products, shows McIlvaine Company. Even more pure water is required as the line sizes on chips are decreasing. This aspect, coupled with the opportunity for water reuse, is creating new opportunities.

06/22/2012 

North-America-based manufacturers of semiconductor fab equipment posted $1.61 billion in orders worldwide in May 2012, $1.54 billion in billings, and a 1.05 book-to-bill ratio, shows SEMI.

06/21/2012 

Rudolph Technologies Inc. (NASDAQ:RTEC) acquired the assets of NanoPhotonics GmbH, adding inspection technology and an intellectual property (IP) portfolio to serve its advanced package inspection tool customers.

06/21/2012 

MicroSense reports an increase in orders for its MRAM magnetic metrology systems. The metrology tools characterize the magnetic properties of multi-layer wafers used in the development and manufacturing of perpendicular MRAM.

06/20/2012 

Qcept Technologies Inc. has received more than 30 orders from 8 customers for its new ChemetriQ Inspection Services (Q-Services), which enable semiconductor manufacturers and equipment vendors to begin implementing non-visual defect (NVD) inspection programs tailored to their needs prior to purchasing a Qcept ChemetriQ NVD inspection system.

06/20/2012 

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.

06/20/2012 

In a webcast scheduled for June 27^th at 1:00 Eastern, 11:00 Pacific, David McCann of GLOBALFOUNDRIES will provide a status report on advanced packaging and 3D integration. McCann is responsible for Packaging R&D and back-end strategy and implementation at GLOBALFOUNDRIES.

06/20/2012 

Mitutoyo America Corporation launched the Surftest SJ-411/412 portable surface roughness tester, conforming to roughness standards JIS-B0601-2001, JIS-B0601-1994, JIS-B0601-1982, VDA, ISO-1997 and ANSI.

06/13/2012 

Older production facilities face equipment obsolescence; skills obsolescence; scarce availability of parts, software, and support; and equipment capability extension and tool re-use. At the ConFab 2012 Executive Roundtable, representatives from Sematech/ISMI, IDMs, OEMs, equipment dealers, and industry consultants gathered to have an open discussion on concerns, roadblocks, and possible solutions.

06/13/2012 

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.