Metrology

METROLOGY ARTICLES



Semiconductor fab tool makers see sequential increase in Q1

06/13/2012 

Semiconductor manufacturing equipment billings and bookings were virtually tied in Q1 2012, reports SEMI, with $10.61 billion in billings and $10.07 in bookings. This is a 13-14% improvement sequentially, and 9% below the same quarter last year.

ams offers foundry customers KGD with enhanced IC test

06/11/2012 

The Full Service Foundry business unit of ams extended its dedicated test solutions for foundry customers, offering known good die (KGD), with customers' complex analog/mixed-signal ICs 100% electrically tested according to their own test specification.

Process Watch: Skewing the defect pareto

06/11/2012 

In the second installment in a series called Process Watch, the author provides tips on how to make sure you’re reviewing the yield killing defects and not wasting time reviewing nuisance events. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions for chip manufacturing at the leading edge.

ConFab interview: G450 Consortium's Tom Jefferson on 450mm timeline

06/06/2012 

Tom Jefferson, G450 Consortium, shares an update on 450mm wafers for semiconductor manufacturing. The consortium is adding staff and ramping its silicon supply, and getting ready for equipment selection.

Record semiconductor fab spending on tap for 2013

06/06/2012 

Fab equipment spending has improved in 2012, breaking the barrier into positive growth for the year, shows SEMI. Semiconductor makers will invest $39.5 billion in fabs, up 2% from 2011 spending. Fab capex will hit a record in 2013, $46.3 billion or 17% above 2012.

Conference Report: IITC, Day 2

06/06/2012 

Mike Fury reports on Day 2 of the 15th IITC (International Interconnect Technology Conference), from San Jose, CA.

Metrology method measures <50nm particles in semiconductor processes to eliminate contaminants down to 12nm

06/05/2012 

W. L. Gore & Associates and CT Associates developed a method for measuring <50nm particles in ultra-pure water (UPW) used in semiconductor processes, and removing particles as small as 12nm, through a combination of ultrafiltration and microfiltration.

Conference Report: International Interconnect Technology Conference, IITC

06/05/2012 

The 15th IITC (International Interconnect Technology Conference) opened Monday, June 4 at the Doubletree Hotel in San Jose, CA. Recurring themes this year were variations on 3D and TSV, novel systems and packaging, and back end memory. Mike Fury reports.

@ The ConFab: How to prevail over silicon cycles

06/04/2012 

At The ConFab’s opening session, “The Economic Outlook for the Semiconductor Industry,” capex was a major point of interest. Jackie Sturm of Intel, Dan Hutcheson of VLSIresearch, and Jim Feldhan of Semico all touched on it, with Hutcheson expanding on the idea of capex trends to present an entire ecosystem of semiconductor business management.

Argonne Labs to characterize diamond microelectronic material with AKHAN

06/04/2012 

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.

Argonne Labs to characterize diamond microelectronic material with AKHAN

06/04/2012 

AKHAN Technologies will collaborate with the Center for Nanoscale Materials at Argonne National Laboratory to fully characterize Miraj Diamond devices and materials, which are made by doping n-type diamond and can be used in the semiconductor industry.

How to cope with semiconductor fab tool obsolescence: ConFab preview

05/31/2012 

Sanjay Rajguru, director of ISMI, will present “Tool Obsolescence and the Impact on 200mm Manufacturing” at The ConFab 2012’s final session, Maximizing the Longevity of Investments.

Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

05/29/2012 

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.

Metrology needs double as semiconductors move from 90nm to 32nm node

05/29/2012 

KLA-Tencor Corporation (NASDAQ:KLAC) measures a 70% increase in fab process steps from 90nm to 32nm semiconductor nodes. This doubles the critical inspection steps required, report Citi analysts.

Process Watch: The dangerous disappearing defect

05/29/2012 

In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.

Field report: CMP users group

05/25/2012 

Michael A. Fury reports on the NCCAVS CMP Users Group meeting, held on May 16th.

ITF: The technology knobs for system scaling

05/25/2012 

At imec's International Technology Forum, An Steegen, Senior Vice President Process Technology at imec, discusses the three technology knobs that are key for a further system scaling.

ITF: Life has changed

05/25/2012 

At imec's International Technology Forum, the research consortium's CEO, Lec van den Hove, draws attention to the need for the industry to solve the world's health problems.

Top suppliers of wafer processing equipment: VLSIresearch survey

05/25/2012 

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. Check out the top-rated suppliers of wafer processing equipment, by company size and customer ranking.

Best semiconductor fab tool suppliers: VLSIresearch survey results

05/25/2012 

VLSIresearch polled semiconductor manufacturers about their tool suppliers, asking chipmakers to rank equipment providers on customer satisfaction. This year’s results show renewed focus on fab needs.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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