Metrology

METROLOGY ARTICLES



North American semiconductor tool makers see higher bookings in April

05/23/2012 

North America-based manufacturers of semiconductor fab equipment posted $1.60 billion in orders and $1.45 billion in billings in April 2012 for a book-to-bill ratio of 1.10, according to SEMI.

SUSS MicroTec takes over SUSS MicroOptics

05/15/2012 

SÜSS MicroTec AG has increased its shareholding in SUSS MicroOptics S.A. to 100%. SUSS MicroOptics is a leading company for high-quality refractive and diffractive micro-optics.

Advantest DRAM test system clocks 8Gbps test speed on every pin

05/14/2012 

Advantest Corporation uncrated the next-generation high-speed DRAM test system, T5511, offering 8Gbps test speed. It can be deployed from R&D through to volume production.

UNL taps SEMI-GAS for semiconductor metrology lab’s gas needs

05/08/2012 

SEMI-GAS Systems, ultra-high-purity gas source and distribution system maker, will outfit the University of Nebraska - Lincoln’s new Nanoscience Metrology Facility. Applied Energy Systems will provide field services.

President Obama speaks at Albany Nano-Tech Complex today

05/08/2012 

President Barack Obama toured the SUNY - Albany Nano-Tech Complex today, speaking about the economy and education in the CNSE NanoFab Extension Building.

Camtek ships semiconductor inspection tools to leading US IDM

05/07/2012 

A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.

CEA-Leti unveils wide-reaching silicon research scope

05/02/2012 

CEA-Leti has introduced the “LETI-3S” concept, for “Silicon Specialty Solutions.” The research is oriented to start-ups, component integrators, fabless or fablite chip companies, and equipment/consumable suppliers.

Become the Best of West at SEMICON West

05/01/2012 

Solid State Technology and SEMI will present the 2012 Best of West product awards at SEMICON West 2012, July 10-12 in San Francisco. Best of West recognizes important product and technology developments in the microelectronics industries.

Major semiconductor makers order EUV lithography metrology tool from Carl Zeiss

04/25/2012 

Carl Zeiss won orders for its EUVL actinic aerial image metrology system, AIMS EUV, from 2 of the 4 members of SEMATECH’s EMI partnership. The tool allows chip makers to review defects in advanced masks needed for EUVL.

KLA-Tencor wafer defect/metrology cluster tool monitors all wafer surfaces in parallel

04/23/2012 

KLA-Tencor Corporation (NASDAQ:KLAC) debuted the CIRCL suite high-throughput defect inspection/metrology/review system for implementation at lithography, outgoing quality control (OQC) and other process modules in semiconductor manufacturing lines.

Metrology tool offers economical price point with high accuracy

04/23/2012 

Hexagon Metrology released the Optiv Classic 321GL tp benchtop vision-measuring metrology system for the North American market. It suits electronics and precision parts inspection, including micro-holes, fiber optics, filters, and more.

Semiconductor subsystems see record revenues thanks to 32nm and below

04/23/2012 

Strong lithography spending, as well as several acquisitions and divestures in the space, brought changes to the critical subsystems of semiconductor/related markets sector, says VLSIresearch. 

North American semiconductor fab tool makers see March book-to-bill hike

04/20/2012 

With a book-to-bill ratio of 1.13, North America-based manufacturers of semiconductor equipment saw a sixth climb in the ratio, which has steadily improved since it hit 0.71 in September 2011, shows SEMI.

ASMC will focus on productivity and technology challenges

04/18/2012 

The 23rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2012) will be held May 15-17 in Saratoga Springs, New York. The conference will feature presentations of more than 85 peer-reviewed manuscripts covering critical process technologies and fab productivity. This year’s event features a panel discussion on “Competing for R&D Dollars,” moderated by Solid State Technology Editor-in-Chief Pete Singer.

Intel’s top suppliers in 2011

04/12/2012 

Intel Corporation announced its 2011 Intel Preferred Quality Supplier (PQS) awards, selecting 19 of its thousands of suppliers. Two suppliers received Intel’s Achievement Award.

Semiconductor wafer fab equipment trends

04/10/2012 

Barclays Capital compiled its 2011 analysis of semiconductor wafer fab equipment (WFE) spending, with a look at the top players and underlying trends by process step.

Semiconductor wafer fab equipment trends: Test

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse looks at the growth areas for test.

Semiconductor wafer fab equipment trends: Process control/Metrology

04/10/2012 

Barclays Capital compiled its 2011 analysis of wafer fab equipment spending, with a look at the top players and underlying trends by process step. CJ Muse considers the rebound in process control due to weak yields at smaller chip nodes.

Wafer fab equipment leaders in 2011 and expectations for 2012

04/09/2012 

Barclays Capital looks at wafer fab equipment trends in 2011, based on Gartner data. Top 5 takeaways? The top 5 vendors continue to gain market share, Intel is a key customer, segment-leading vendors strengthened their holds, intensity edged higher, and changes are in store in 2012.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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