Metrology

METROLOGY ARTICLES



Semiconductor foundry integrates Nova metrology for CMP at various nodes

04/04/2012 

Metrology tool supplier Nova Measuring Instruments Ltd. (NASDAQ:NVMI) will provide the production tools of record performing CMP metrology at a leading foundry.

Bruker bolsters CT imaging line with SkyScan buy

04/02/2012 

Bruker Corporation acquired all of the shares of SkyScan NV, a scientific instruments company serving materials science and life sciences/pre-clinical imaging needs.

ARM’s Segars sees changing requirements for electronics driven by mobile

03/26/2012 

At the recent Common Platform Technology Forum -- produced by Global Foundries, Samsung and IBM -- Simon Segars, executive vice president and general manager of the physical IP division at ARM, spoke about the impact of the internet of things and mobile computing on the way electronics are designed and used.

Semiconductor capex to fall 11.6% in 2012, says Gartner

03/21/2012 

Worldwide semiconductor manufacturing equipment spending is projected to total $38.9 billion in 2012, an 11.6% decline from 2011 spending of $44 billion, according to Gartner Inc.

High-volume semiconductor fab reduces particle contamination test time

03/21/2012 

A high-volume semiconductor fab using particle monitor wafers to test for contamination in wafer fab tools looked to reduce its labor and test time. The fab switched to wireless wafer-like airborne particle sensors. Allyn Jackson, CyberOptics Semiconductor, shares the case study.

Advantest manufactures piezoelectric MEMS for semiconductor testing

03/19/2012 

Advantest Corporation began producing MEMS relays for semiconductor testing equipment, high-speed communications devices, HF wave measurement equipment and their components.

New LTXC semiconductor test tools suit ASSP, RF test

03/19/2012 

LTX-Credence Corporation (Nasdaq:LTXC) released the Diamondx test platform for ASSP and the DragonRF for RF device test. In addition, LTX-Credence launched a SerDes test instrument and new testing software.

AMAT loses top spot in VLSIresearch semiconductor equipment supplier rankings

03/16/2012 

VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.

Samsung, IBM and GlobalFoundries look to the future: A report from the Common Platform Technology Forum

03/15/2012 

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

imec studies molecular beam epitaxy for advanced CMOS on high-mobility compound semiconductors

03/13/2012 

Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.

Semiconductor manufacturing equipment sales rose 9% in 2011

03/13/2012 

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.

Semiconductor foundries order Nova metrology tools for 2Xnm node

03/12/2012 

Nova Measuring Instruments Ltd. (NASDAQ:NVMI) received $12 million in orders from leading semiconductor foundries for metrology on 2Xnm manufacturing ramp ups.

Confovis taps Digital Surf for metrology tool imaging software

03/09/2012 

Confovis will begin providing MountainsMap imaging and surface analysis software from Digital Surf with its ConfoCAM LED grid-confocal measuring systems for inspection and research.

Semiconductor fab equipment spending to hit a record in 2013

03/06/2012 

Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.

TSMC, Samsung foundries reconsidering 2012 capex on stronger 28nm demand

03/05/2012 

After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.

Metrology project launches in Europe for thin films

03/02/2012 

The National Physical Laboratory in the UK is leading a new EMRP project on thin film manufacturing metrology for industries such as opto electronics, plastic and printed electronics, displays and lighting, memories and solar cells.

Nanolab Technologies doubles space for IC analysis services

02/29/2012 

Nanolab Technologies Incorporated inaugurated its 47,000sq.ft. state-of-the-art facility in Milpitas, CA, more than doubling Nanolab Technologies' space.

GLOBALFOUNDRIES hires procurement exec to manage capex expansions

02/29/2012 

GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.

North American chip fab tool makers report 4th month of orders growth in January

02/24/2012 

North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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