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WEBCASTS
 Environment, Safety & Health Date and time TBD The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.
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Wafer Processing Date and time TBD As the industry moves to 10nm and 7nm nodes, advances in wafer processing etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.
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CAMECA unveiled the latest addition to its line of high-end metrology systems: the EX-300 metrology tool targeted for front-end process control of 22 nm technology nodes and beyond. e EX-300 is a versatile metrology tool based on LEXES (Low-energy Electron induced X-ray Emission Spectrometry) technology.
Rudolph Technologies Inc. (RTEC) is partnering with a major outsourced semiconductor assembly and test (OSAT) services manufacturer to provide its inspection and metrology capability in the development of stacked packaging processes. The process uses silicon interposer technology, sometimes referred to as 2.5D IC, as an intermediate step toward full blown 3D ICs.
The phoenix nanotom m, from GE´s Inspection Technologies business, has been developed for high resolution and high precision X-ray computed tomography (CT) in non-destructive 3D analysis and 3D metrology.
Carl Zeiss SMS and Synopsys will collaborate to support in–die metrology solutions for the 32nm technology node and below. Using CATS as a data preparation engine, mask engineers using PROVE can benefit from improved efficiency and usability of a registration metrology system that meets stringent overlay accuracy requirements.
With the development and production release of the microRSP-A300, CAPRES has addressed the challenges associated with in-line measurement on production wafers, reducing reliance on data extrapolation and monitor wafers to validate doping levels.
Authors from Synopsys and IMEC assess the readiness of rigorous physical resist model calibration for accurate EUV lithography simulation. They discuss pattern selection for calibration, illustrate the speed and robustness of model building, and examine model validation results. Predictability of the resist model is demonstrated across various flare levels, pitches and critical-dimension ranges.
Tom Gubiotti, product marketing manager at KLA-Tencor, discusses the design decisions that drove the company’s new film metrology tool -- the Aleris 8330 -- targeted for non-critical films at 32nm and below. Among the drivers -- especially for memory manufacturers -- is the need for high-throughput, low cost-of-ownership tools that are capable of recipe sharing around the fab, so-called, “future proofing.”