Metrology

METROLOGY ARTICLES



Worldwide semiconductor revenue hit record $120.8B in Q2 2018

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.

Seven top 15 semi suppliers of the first half of 2018 register ?20% gains

08/20/2018  Samsung extends its number one ranking and sales lead over Intel to 22%.

2018 IEEE IEDM to showcase breakthrough in semiconductor technology

08/17/2018  This year's theme is "Device Breakthroughs from Quantum to 5G and Beyond" -- chosen to reflect the expanding reach of electronics technology in society.

Nordson SONOSCAN unveils Gen7 tool on Windows 10

08/17/2018  Nordson SONOSCAN, a developer and producer of acoustic micro imaging (AMI) tools, announces its new Gen7 laboratory style acoustic micro-imaging tool.

WFE semiconductor equipment billings to drop 24% in second half of 2018

08/16/2018  On the heels of a 37.3% growth in wafer front end (WFE) semiconductor equipment growth in 2017, the market will grow only 10% in 2018 to $62.3 billion.

SEMI integration of ESD Alliance underway

08/14/2018  SEMI today announced that all legal requirements have been met for the ESD (Electronic Systems Design) Alliance to become a SEMI Strategic Association Partner.

Size of semiconductor acquisitions may have hit limit

08/14/2018  Mega-mergers become less likely because of the high-dollar value of major acquisitions, increasing scrutiny from regulators, rising protectionism among more countries, and growing global trade frictions.

Strong 2Q'18 global supply chain growth but second half slowing

08/14/2018  Semiconductor capital equipment sales are historically very volatile, with their growth fluctuating MUCH MORE than electronic equipment.

European electronics industry CEOs call on European Commission to bolster sector's competitiveness

08/08/2018  In a bid to reinvigorate Europe’s electronics strategy and strengthen the region’s position in key emerging technologies, European electronics industry CEOs in June called on public and private actors to accelerate collaboration at the European Union and national levels.

SEMI China, CASPA promote China-Silicon Valley innovation partnership

08/08/2018  Aiming to forge stronger ties between the two technology heavyweights as partners in semiconductor industry innovation, SEMI and CASPA (Chinese American Semiconductor Professional Association) in mid July signed a strategic cooperation agreement to promote industry innovation between Silicon Valley and China.

Mid-year global semiconductor sales up 20.4% compared to 2017

08/06/2018  Q2 sales are highest on record, 6.0 percent more than previous quarter, 20.5 percent higher than Q2 of last year.

SEMI High-Tech Facility events: Shaping the future of smart factories in Taiwan

08/02/2018  The march to greater precision, efficiency and safety – the lifeblood of high-technology manufacturing facilities – has taken on a new urgency as emerging applications such artificial intelligence (AI), the Internet of Things (IoT) and Industry 4.0 give new meaning to smart factories.

The rebirth of the semiconductor industry

08/02/2018  We’re living in a digital world where semiconductors have been taken for granted. But, Artificial Intelligence (AI) is changing everything – and bringing semiconductors back into the deserved spotlight.

John Hennessy, Alphabet Chairman and former Stanford President, to receive semiconductor industry's top honor

08/01/2018  Hennessy, pioneer in electrical engineering, will accept 2018 Robert N. Noyce Award at SIA Award Dinner on Nov. 29.

SEMI supports congressional calls to remove China trade tariffs

07/31/2018  SEMI today announced its support for calls yesterday by nearly 50 members of Congress for the Trump Administration to remove tariffs on U.S. semiconductor products imported from China.

Second quarter 2018 silicon wafer shipments increase quarter-over-quarter to an alll-time quarterly high

07/30/2018  Reaching their highest recorded quarterly level ever on robust demand, worldwide silicon wafer area shipments rose 2.5 percent in the second quarter of 2018 to 3,160 million square inches from 3,084 million square inches the previous quarter, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

SEMI testifies against U.S. tariffs; Members meet with congressional leaders urging trade action

07/30/2018  Two months after opposing $34 billion in U.S. trade tariffs on behalf of the U.S. semiconductor manufacturing industry, Jonathan Davis, global vice president of industry advocacy at SEMI, this week spoke out against an additional $16 billion duties on Chinese goods.

School district of Osceola County first to deliver SEMI High Tech U program

07/26/2018  In a key move to inspire the next generation of innovators, the School District of Osceola County (SDOC) today became the first school district to join the SEMI High Tech U (HTU) Certified Partner Program (CPP), a curriculum that prepares high-school students to pursue careers in STEM fields.

Semiconductor Research Corporation releases $26M in new research funds

07/26/2018  JUMP program funds 24 new research projects to amplify mission of its six innovation centers.

SIA applauds new DoD research partnerships to advance transformative semiconductor technologies

07/25/2018  DARPA selects research teams from industry, academia to receive funding through its Electronics Resurgence Initiative to bolster next-generation semiconductor design, materials, architectures.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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