OLEDs

OLEDS ARTICLES



OLED thin-film encapsulation technology key to new applications

06/29/2012 

OLED thin film encapsulation technology is the one of technologies emerging as the core technology of flexible OLED, and technology development and patent securing competition between world’s leading OLED companies will increase accordingly, shows Displaybank.

Guide to LED and OLED programs at SEMICON West

06/28/2012 

SEMICON West 2012 will take place July 10-12 at the Moscone Center in San Francisco, CA. Following is a preview of the LED and OLED events taking place during SEMICON West, from contributor Paula Doe, SEMI Emerging Markets.

Sony, Panasonic combine OLED manufacturing expertise to achieve large-panel, low-cost fab

06/25/2012 

Panasonic and Sony will combine their core and printing technology to jointly develop next-generation organic light-emitting diode (OLED) panel and module manufacturing technology.

MIT team models electronic behavior of OLEDs and other organic electronics

06/22/2012 

A multidisciplinary research team at MIT and the Universidad Autónoma de Madrid developed a new mathematical approach to simulating the electronic behavior of noncrystalline materials, with applications in OLEDs, flexible printable organic electronic circuits, and solar cells.

PANL hits white OLED performance record

06/11/2012 

Universal Display Corporation (NASDAQ: PANL) announced record-breaking performance of its white organic light-emitting diode (OLED) lighting technology.

Universal Display intros novel emission layer systems for OLEDs

06/05/2012 

Universal Display Corporation (NASDAQ: PANL) introduced new red, green, and yellow UniversalPHOLED products, combining UniversalPHOLED emitter materials with novel host systems.

Novaled's new OLED materials set could double OLED lifetimes

05/31/2012 

Novaled debuted a class of n-doped electron transport layer (ETL) materials for OLED TV and mobile displays.

CNTs produced with >95% semiconducting content now available from SWeNT

05/31/2012 

SouthWest NanoTechnologies (SWeNT) released SG65i, a single-wall carbon nanotube product with >95% semiconducting concentration, before secondary processing to remove metallic SWCNT content.

Largest flexible OLED display fabbed with mixed-oxide TFT

05/30/2012 

The Flexible Display Center at ASU, in conjunction with Army Research Labs scientists, manufactured what it is reporting as the world's largest flexible, full-color OLED display prototype. FDC used advanced mixed-oxide TFTs to build the 7.4” device.

3M flexible barrier films for displays come to market

05/22/2012 

M’s Optical Systems Division made its flexible, optically clear 3M FTB3-50 and FTB3-125 films available commercially, to protect sensitive electronics displays from water vapor and oxygen. The films previously were sold under limited R&D agreements.

OLED is a technology, not an answer, for TVs: DisplaySearch

05/21/2012 

DisplaySearch's Paul Gray advises that TV makers “think deeply about how consumers are watching long-form video at home” before leaping to conclusions about OLED’s impact. “The industry need not take billion dollar technology bets to provide better products.”

The low utilization/MOCVD uptick phenomenon, LED efficacy and price, more from Lightfair

05/14/2012 

Barclays Capital analysts attended Lightfair International and gleaned several trends in LEDs and OLEDs for lighting, including an interesting phenomenon around MOCVD utilization rates and new orders.

3D micro-structuring, OLED display fab nab laser awards

05/11/2012 

The Innovation Award Laser Technology 2012 recognized 3D metal micro-structuring laser technology from Schepers, excimer laser design for OLED and LCD display fab from Coherent, and a laser brazing head technology from Precitec Optronik.

OLED manufacturers develop new color patterning technologies for large-area fab

05/10/2012 

OLEDs are gaining adopters in small screen sizes, and just moving into large-size displays. Mass production color-patterning technology for large-area OLED is increasingly an issue. Displaybank looks at new technologies under development at major display makers.

EMAN wins OLED micro-display follow-on order from Army

05/04/2012 

eMagin Corporation (NYSE Amex:EMAN) received a $3.1 million follow-on order for OLED microdisplays under an existing US Army Remote Viewer Program.

AMOLED scales up with virtually 100% concentration in Korea

04/27/2012 

Active-matrix organic light-emitting diode (AMOLED) displays manufacturing is virtually 100% concentrated in Korea, according to Displaybank, with Samsung Mobile Display (SMD) and LG Display (LGD) scaling up capacity.

Semiconductor investments from venture capital sector fall in March

04/23/2012 

Investments in fabless companies, semiconductor suppliers, and other chip companies fell more than 80% month/month and year/year in March, reports the Global Semiconductor Association (GSA).

OLEDs erode LCD dominance, starting in small displays

04/20/2012 

Organic light-emitting diode (OLED) will be a nearly $11 billion market in 2017, and will take some display market share from the $100-billion LCD sector, according to a Lux Research report.

AMOLED use in small/medium displays prompts more suppliers, more adopters

04/12/2012 

Active matrix organic light-emitting diodes (AMOLEDs) are moving from small-quantity development into higher volumes, with shipments destined for smartphones driving growth in the small- and medium-sized display market in February, said IHS.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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