Packaging

PACKAGING ARTICLES

Nominations open for ESD Alliance Governing Council

02/26/2019 The Electronic System Design Alliance, a SEMI Strategic Association Partner, today opened nominations for member company executives to serve on the ESD Alliance Governing Council for the next two-year term.

Cadence CMP Process Optimizer enables Toshiba Memory to accelerate delivery of advanced 3D Flash memory devices

02/25/2019 Cadence Design Systems, Inc. today announced that Toshiba Memory Corporation has successfully used the Cadence CMP Process Optimizer, a model calibration and prediction tool that accurately simulates multi-layer thickness and topography variability for the entire layer stack, to accelerate the delivery of its advanced 3D flash memory devices.

Soitec joins China Mobile 5G Innovation Center

02/25/2019 Soitec, a designer and manufacturer of innovative semiconductor materials, today announced it is the first materials supplier to join the China Mobile 5G Innovation Center.

GOWIN Semiconductor announces release of the new GOWIN EDA tools for improved performance on new FPGA product families

02/22/2019 GOWIN Semiconductor Corp. announces the release of GOWIN's new EDA tool, YunYuan 1.9.

Synopsys and GLOBALFOUNDRIES collaborate to develop industry's first automotive grade 1 IP for 22FDX process

02/21/2019 Synopsys, Inc. and GLOBALFOUNDRIES today announced a collaboration to develop a portfolio of automotive Grade 1 temperature DesignWare Foundation, Analog, and Interface IP for the GF 22-nm Fully-Depleted Silicon-On-Insulator process.

Rice U. researchers unveil Internet of Things security feature

02/20/2019 'Physically unclonable function' is 10 times more reliable than previous methods.

CEA-Leti and Stanford target edge-AI apps with breakthrough NVM memory cell

02/20/2019 Researchers at CEA-Leti and Stanford University have developed the worlds first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM.

GlobalFoundries and Dolphin Integration to deliver differentiated FD-SOI adaptive body bias solutions

02/19/2019 IP to accelerate energy-efficient SoC designs and push the boundaries of single-chip integration.

eSilicon builds momentum as a strong tier one FinFET ASIC supplier

02/15/2019 eSilicon, a provider of FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, announced today the achievement of multiple milestones related to the company's growth in the tier one FinFET ASIC market, serving high-bandwidth networking, high-performance computing, AI and 5G infrastructure.

Cadence selected as primary EDA tool vendor by GLOBALFOUNDRIES

02/15/2019 Cadence Design Systems, Inc. today announced that GLOBALFOUNDRIES (GF) has chosen Cadence as the primary EDA tool vendor for use in Avera Semi, a GF subsidiary, for advanced node chip design projects.

Advanced packaging: At the heart of innovation

02/14/2019 The semiconductor industry showed impressive figures in 2017: +21.6% YoY growth to reach about US$ 412 billion.

Who is leading the RF GaN IP landscape?

02/13/2019 The RF GaN industry is showing an impressive growth with a 23% CAGR between 2017 and 2023, driven by telecom and defense applications. By the end of 2017, the total RF GaN market was close to US$380 million and 2023 should reach more than US$1.3 billion with an evolving industrial landscape.

The "Wall," political gridlock and China: SEMI's take on SOTU address

02/12/2019 For public policy lovers, civic-minded, engaged U.S. citizens, and people around the world interested in the U.S. Presidents positions and priorities, the annual State of the Union address (SOTU) is "must-see TV."

WEBCASTS

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.