Packaging and Testing

PACKAGING AND TESTING ARTICLES



Will MEMS applications be the driver for future growth of thin film PZT?

11/21/2013  In September 2013, EPSON announced its next generation inkjet technology, PrecisionCore, introducing for the first time MEMS inkjet heads manufactured with thin film PZT technology. This announcement has been highly publicized: first, thin film PZT MEMS applications are now on the market, proving the reliability and maturity of this technology. Second, more inkjet head players will soon follow.

Annual MEMS Executive Conference shows why MEMS is growing 2x faster than semiconductors

11/15/2013  MEMS Industry Group (MIG)'s MEMS Executive Congress -- held November 7-8, 2013 in Napa, CA -- showed why the MEMS industry is outpacing the semiconductor industry, in both growth and innovation.

MIG honors STMicroelectronics with three different awards

11/11/2013  STMicroelectronics has been selected by MEMS Industry Group and affiliated voters as the Company of the Year for its continuing success in growing its MEMS business, expanding its product line, and demonstrating industry leadership and vision.

EU project to industrialize world record high-density capacitors

10/23/2013  CEA-Leti, Fraunhofer IPMS-CNT and three European companies have launched a two-year project to industrialize 3D integrated capacitors with world-record density using atomic layer deposition.

STMicroelectronics receives Innovation Management Award for chip manufacturing tech

10/02/2013  STMicroelectronics announced on Tuesday it has won a prestigious BearingPoint Innovation Management Award for its FD-SOI technology in the "Innovation Ecosystem" category.

InvenSense opens Korean design center

10/02/2013  InvenSense, Inc., the provider of MotionTracking system on chip devices, announced the opening of a new design center in Seoul, Korea.

From smart cars to smart cities: Shaping the future of microelectronics at ITPC 2013

10/02/2013  Experts in aerospace, automotive, mobile communications, Smart Cities and more join semiconductor leaders to shape the future of microelectronics at the International Technology Partners Conference (ITPC), to be held in Maui, Hawaii, on November 10-13.

All ST’s front-end manufacturing sites achieves ISO 50001 energy-management certification

10/01/2013  STMicroelectronics this week has announced that all six of its front-end manufacturing sites have achieved certification to the latest, most stringent ISO 50001 energy-management standard.

3D-IC: Two for one

09/25/2013  Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. blogs about upcoming events related to 3D ICs.

STMicroelectronics chip controls Pebble Smartwatch

09/18/2013  STMicroelectronics announced this week that its STM32 microcontroller is the brain controlling the innovative Pebble Smartwatch for iPhone and Android.

The advantages of a hybrid scan test solution

09/12/2013  Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

Tailored gyroscopes from STMicroelectronics target shake-free images on mobiles and cameras

09/10/2013  STMicroelectronics has introduced a new family of gyroscopes specifically optimized for optical image stabilization in smartphones and digital still cameras.

Next level of MEMS industry development to be examined at SEMICON Europa

09/05/2013  Driven by value-creating applications in mobile phones, automotive, displays and other systems, the global MEMS industry has grown to over $11 billion in 2012, a 10 percent compound annual average growth rate since 2008.

Advancing graphene for post-silicon computer logic

09/03/2013  Team of UC Riverside researchers pioneer new approach for graphene logic circuits.

Sand 9 launches new MEMS timing products

09/03/2013  Sand 9, Inc. today announced the first MEMS timing products specifically designed to meet the stringent performance, cost, size and reliability requirements of high-volume mobile applications

Sono-Tek expands in-house laboratory testing facilities

08/13/2013 

Sono-Tek Corporation, a global ultrasonic spray technology company, announces a just completed expansion of their laboratory testing facility, located at their corporate headquarters in Milton, NY.

MEMS is still on a dynamic growth path, targeting USD 22.5 billion in 2018

08/06/2013 

In 2012, the IC industry saw a two percent decline, but Yole Développement's research reveals the MEMS sector managed another 10 percent growth to become an $11B business.

InvenSense announces headquarters relocation

08/02/2013 

InvenSense, Inc., a provider of MotionTracking system on chip devices, is relocating its headquarters to 1745 Technology Drive, San Jose, California.

MEMS New Product Development: The importance of product validation

07/31/2013 

Product validation is an essential part of all successful MEMS new product developments. It is the process of testing products under various environmental, mechanical or electrical conditions to simulate life in an accelerated manner.

Driven by Apple and Samsung, light sensors achieve double-digit revenue growth

07/30/2013 

Light and proximity sensors in mobile handsets and tablets are set for expansive double-digit growth within a five-year period, thanks to increasing usage by electronic giants Samsung and Apple.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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