Packaging and Testing

PACKAGING AND TESTING ARTICLES



MediaTek introduces tablet SoC

07/29/2013 

MediaTek Inc., a  fabless semiconductor company for wireless communications and digital multimedia solutions, today announced its breakthrough MT8135 system-on-chip (SoC) for high-end tablets.

New NIST nanoscale indenter takes novel approach to measuring surface properties

07/25/2013 

Researchers from the National Institute of Standards and Technology (NIST) and the University of North Carolina have demonstrated a new design for an instrument, a "instrumented nanoscale indenter," that makes sensitive measurements of the mechanical properties of thin films -- ranging from auto body coatings to microelectronic devices -- and biomaterials.

EU FP7 continues to support Europractice IC services

07/25/2013 

Together with its partners STFC and Fraunhofer IIS, imec announced today that the European Commission has pledged to continue funding the Europractice IC services for another three years under the Seventh Framework Programme (FP7).

Micralyne and Adament to develop MEMS-based fiber-optic subsystems

07/24/2013 

Companies announce alliance to bring high-performance sensors to market.

MEMS for mobile industry will reach $6.4B by 2018

06/20/2013 

Market demand for new sensors will lead to a $6.4B market by 2018.

Necessary attributes of a MEMS engineer for new product development

06/10/2013 

In the development of new MEMS products, the team is the most important factor.

Leti Innovation Days to present preview of future developments in nanotechnologies

06/06/2013 

CEA-Leti will present recent advances and a preview of future developments in micro- and nanotechnologies, followed by workshops on key technical fields, during Leti Innovation Days, June 25-28, on the MINATEC campus.

Fab equipment spending: 23% growth for 2014

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

Bosch reaches 3 billion sensor milestone

06/04/2013 

Since the start of production in 1995, Bosch has manufactured well in excess of three billion MEMS sensors.

OMRON develops MEMS non-contact thermal sensor utilizing wafer-level vacuum packaging

05/29/2013 

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.

Leti to present latest R&D results in MEMS at Transducers’ 2013 in Barcelona

05/29/2013 

CEA-Leti will host a workshop for industrial companies to present its latest advances in MEMS and an overview of the success of its recent MEMS startup, Wavelens, during Transducers’ 2013 and Eurosensors XXVII in Barcelona, Spain.

Combo MEMS inertial sensors report brisk growth in automotive market

05/13/2013 

Combo MEMS sensors for automotive applications are off to another exhilarating ride this year as revenue continues to climb, spurred by rapidly accelerating use in car safety systems.

Leading MEMS microphone suppliers ride Apple’s gravy train to the top

05/01/2013 

Once again demonstrating Apple’s power to ordain winners in the electronics supply chain, the top suppliers last year of microelectromechanical systems microphones were those that provided devices for iPhones and iPads.

Kurt Petersen, MEMS industry pioneer and technology vision, joins IMT board of directors

04/30/2013 

IMT, the largest pure-play MEMS foundry in the US, announced today the appointment of MEMS industry pioneer and technology visionary Dr. Kurt Petersen to the IMT board of directors.

TSMC

04/26/2013 

TSMC

M2M Forum 2013 explores MEMS and the future of medical devices

04/23/2013 

MEMS Industry Group (MIG), a global industry organization with more than 140 member-companies and partners, will welcome micro-electromechanical systems (MEMS), medical industry and academic experts to Cambridge, Mass. for Member-to-Member (M2M) Forum 2013, a conference on the MEMS connection to advancements in healthcare, medical and biomedical applications.

Top 30 MEMS companies of 2012

04/19/2013 

The fast growing market for sensors for smart phones is re-shuffling the ranks of MEMS suppliers. For the first time, suppliers of inertial sensors have surpassed the major makers of micro mirrors and inkjet heads that have long dominated the industry on Yole Développement’s annual ranking of the Top 30 MEMS companies.

Examining the MEMS gyroscope patent landscape

04/17/2013 

The gyroscope market is driven by mobile applications, where until recently only two players, STMicroelectronics (ST) and InvenSense, were competing.

Health awareness spurs quadrupling in MEMS sensor market for wearable electronics

04/09/2013 

From smart wristwatches that record heart rates, to intelligent armbands that track physical activities, wearable electronics and fitness monitoring devices are attracting increased attention from health-conscious consumers, causing shipments of MEMS sensors used in these products to more than quadruple in just five years.

New miniaturization record by STMicroelectronics makes more room for mobile functionality

04/08/2013 

STMicroelectronics has introduced the world's smallest TVS diode for protecting sensitive electronics in consumer products and handhelds.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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