01/24/2013  Looking at the global MEMS market, industry experts are predicting double-digit device growth in the next three to five years.

01/03/2013 

Sensors and optoelectronics will continue to grow faster than the mainstream semiconductor market. We currently expect 9%-13% growth in these sectors in 2013, accompanied by rapid changes in technology and  market structures.

12/17/2012 

Demand for microelectromechanical systems (MEMS) devices, particularly pressure sensors for harsh environments, will grow 20% in 2012 on the way to a 9% CAGR for the next several years.

12/06/2012 

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

11/12/2012 

MIPI Alliance has formed an open "Birds of a Feather" (BoF) group that will investigate the requirements related to integrating sensors into mobile systems. The group will address challenges facing the sensor and wireless markets.

11/01/2012 

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.

10/16/2012 

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

10/08/2012 

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

10/08/2012 

Sensirion AG says it will debut at Electronica 2012 (Nov. 13-16, Munich, Germany) what it says is the world's smallest humidity and temperature sensor: a 2mm × 2mm × 0.8mm in size, based on its CMOSens technology that combines the sensor and signal processing on a single chip.

10/02/2012 

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

09/27/2012 

A device that measures very thin quantities of liquid, such as the synovial fluid in knee joints, and a device that measures change in mass when a microdevice adsorbs small amounts of material, earned top honors in Sandia National Labs' annual student MEMS design contest.

09/17/2012 

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

08/21/2012 

Heptagon, wafer-level optics maker, ordered an advanced DWL 2000 maskless lithography system from Heidelberg Instruments. The tool has sophisticated Gray Scale Exposure capability.

08/20/2012 

The second annual SensorsCon 2013, the conference for Sensors Technology, Design and Applications, March 6, 2013, Techmart Center, Santa Clara, CA, is accepting applications for exhibitors, sponsors and speakers.

08/20/2012 

SEMICON Taiwan 2012, held September 5-7, will feature both Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who will discuss innovation in MEMS design, manufacture, packaging, testing and equipment.

08/15/2012 

The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.

08/13/2012 

MEMS Executive Congress 2012 in Scottsdale, AZ, will host keynotes from Ajith Amerasekera, TI Fellow, IEEE Fellow, in Texas Instruments’ Kilby Labs, who will discuss how immersive intelligent systems will change the management of our cities, buildings, personal life, health, transportation, safety and security; and Robert Brunner, founder, creative director and partner, Ammunition, who will explore the critical connection between brand identity and connection to consumers.

08/08/2012 

Standardized testing and measurement methods, NIST argues, will enable MEMS lab-on-chip manufacturers to accurately determine important physical characteristics of LOC devices such as dimensions, electrical surface properties, and fluid flow rates and temperatures. These must be calculable at all stages of production, from processing of raw materials to final rollout of products.

08/02/2012 

Movea, motion processing and data fusion technology developer, raised EUR6.5m in a funding round led by Intel Capital, with existing investors iSource and GIMV. We are increasing our involvement in the MEMS sector in general, said Erik Jorgensen, Intel Capital.

07/24/2012 

Yole updated its MEMS industry database, World MEMS Players 2012. The product includes contact information for MEMS players, geographical breakdown of the industry, and various MEMS device categories.