Packaging and Testing

PACKAGING AND TESTING ARTICLES



Aerotech launches sensor fusion data acquisition device

07/20/2012 

Aerotech’s Sensor Fusion is a 3U data acquisition device integrated with the company’s A3200 motion controller to provide precise time alignment of motion and data acquisition functions.

MEMS characterization with optical measurement: Polytec presents characterization studies

07/20/2012 

MEMS must be characterized during device development. Polytec asserts that advanced optical measurement techniques are necessary for characterization, as electrical tests can check functionality, but not all physical properties.

Self-calibrating MEMS override manufacturing variations

07/18/2012 

Purdue researchers have demonstrated self-calibrating MEMS, which enable higher accuracy for existing and new MEMS applications and could eliminate 30% of manufacturing costs by skipping test processes.

Spirent MEMS sensor simulator tests sensor fusion algorithms

07/17/2012 

Spirent Communications launched its new SimSENSOR sensor simulation software, enabling R&D technicians to test sensor fusion algorithms in navigation systems that include MEMS inertial sensors and multi-GNSS.

2012 ITRS update: Back-end packaging and MEMS

07/13/2012 

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.

Roadmapping More than Moore: When the application matters

07/13/2012 

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.

InvenSense claims smallest 6-axis MEMS combo sensor

07/10/2012 

InvenSense (NYSE: INVN), MEMS-based sensor maker, introduced its second-generation MPU-6500 6-axis MotionTracking device for smartphones, tablets, wearable sensors, and other consumer markets.

Tessera: Adding Vista Point Technologies, losing Powertech Technology?

07/02/2012 

Tessera received notice from Powertech Technology Inc. (PTI) that it will terminate its license agreement with the semiconductor packaging and optics technology company. Tessera also completed phase 1 of its acquisition of camera module technologies from Flextronics.

Guide to MEMS at SEMICON West 2012

06/28/2012 

Paula Doe, SEMI Emerging Markets, shares the annual guide for navigating the MEMS events at SEMICON West, July 10-12 at Moscone Center in San Francisco, CA.

SEMICON West preview: MEMS manufacturing changes with HV consumer apps

06/27/2012 

Paula Doe, SEMI Emerging Markets, covers developments at Applied Materials, Coventor, and other members of the MEMS equipment supply chain that will make MEMS less expensive, smaller, and easier to manufacture.

SPTS Technologies joins MEMS consortium

06/21/2012 

SPTS Technologies joined the MEMS Consortium, led by the Institute of Microelectronics (IME), a member of the Agency for Science, Technology and Research (A*STAR) in Singapore.

High-volume MEMS manufacturer adds FOGALE metrology tool

06/20/2012 

A major high-volume MEMS maker has purchased a FOGALE nanotech T-MAP DUAL 3D 200A for its US manufacturing facility. The tool will be equipped with 2 load ports and will be fully automated.

SEMICON West preview: Maturing MEMS sector looks at ways to work together

06/19/2012 

Driven by the volume consumer business, the maturing MEMS sector starts to look at ways to reduce costs and speed time to market by coming together on things like easing integration, common test methods, and tool replacement parts, reports Paula Doe, SEMI. Fast-moving high-volume markets may also drive MEMS makers toward paring down the vast diversity of processes and packages used, and into more collaboration on a mature ecosystem.

Metrology merger: MicroSense acquires SigmaTech

06/13/2012 

MicroSense, maker of high-resolution capacitive position sensors, metrology modules, and high-sensitivity magnetic metrology tools, acquired SigmaTech, developer of high-sensitivity metrology tools for LED, MEMS, and semiconductor manufacturing.

Tohoku University and imec partner to advance research

06/11/2012 

Tohoku University of Sendai, Japan and imec signed a collaboration agreement during the Belgian economic mission to Japan, expanding their R&D into areas such as MRAM and 3D semiconductor packaging.

Conference report: MEMS Business Forum

05/25/2012 

The first MEMS Business Forum, sponsored by MEMS Journal and MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 24 at the Santa Clara Biltmore Hotel. Ten speakers presented on topics ranging from near- and mid-term business opportunities to roles of MEMS in broad visions for the future.

ITF: New approaches in the battle against cancer

05/25/2012 

At imec's International Technology Forum, Denis Wirtz, co-director of the John Hopkins Institute for NanoBio Technology, described the latest efforts to fight cancer.

ITF: Healthcare applications of silicon photonics

05/25/2012 

At imec's International Technology Forum, Roel Baets, director of the Centre for Nano- and Biophotonics Ghent University, Belgium, said silicon photonics will drastically change the way bio research is conducted.

ITF: Connecting biology with microsystems

05/25/2012 

At imec’s International Technology Forum, Peter Peumans, department director bio-nano electronics of imec, described promising examples of : technologies that connect biology and Microsystems: Biotechnology: bioreactors, neuroprobes, high speed cell inspection, and high-throughput molecular analysis.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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