06/04/2008  June 3, 2008 -- Toshiba has optimized for MEMS two packaging technologies that promise significant cost reductions. The company says it will further develop them for practical use.

04/18/2008  Luke P. Lee, Ph.D., from the Department of Bioengineering at UC Berkeley has been selected as keynote speaker for MEPTEC's 6th Annual MEMS Packaging symposium titled "MEMS Market Evolution: From Technology Push to Market Pull" on May 22, 2008. This one-day event will take place at the Wyndham Hotel, San Jose, CA.

03/28/2008  Mar. 28, 2008 - In a sector dominated by expensive customized products, the best opportunities in the MEMS test equipment market are to develop cost-effective standardized technologies, according to a new report from Frost & Sullivan.

03/27/2008  ; If the MEMS test equipment market is to match the pace of the overall MEMS market, it has to develop cost-effective, standardized solutions. This is especially pertinent in a market where expensive customized products vastly outnumber off-the-shelf products. New analysis from Frost & Sullivan "World MEMS Test Equipment Markets," finds that the market earned revenues of $56.5M in 2007 and estimates this to reach $120.2M in 2014.

02/20/2008  With the recent investment of $5 million in MEMS packaging capabilities, Infotonics Technology Center (ITC) is positioning itself as a full-service partner for customers seeking to create new MEMS-based devices and microsystems.

02/05/2008  ; EV Group (EVG) has announced it has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. The systems will be for a new Indian government-supported automotive MEMS R&D project and are slated for installation this month in IIT Bombay's Mumbai facility.

02/01/2008  ; Following a successful series of events held in Europe, MEMUNITY has announced its eighth workshop under the title "Critical Success Factors for Commercialization: Production Test of MEMS at Wafer Level". The workshop will be held on March 13 at the Institute for Microelectronic and Micromechanical Systems (IMMS) in Ilmenau, Germany.

01/28/2008  Research and Markets has announced the availability of a new book, Reliability of MEMS.

11/19/2007  November 19, 2007 - The MEMS Industry Group, a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other's goals and industry events, through a variety of marketing programs.

10/04/2007  ; Integrated Sensing Systems, Inc. (ISSYS) was awarded a Phase II Small Business Innovation Research contract from the National Science Foundation (NSF). The 2-year project, "Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems," is aimed towards development of a novel packaging method to simplify the packaging of MEMS and their associated electronics.

10/04/2007  Integrated Sensing Systems Inc. (ISSYS) has received a Phase II Small Business Innovation Research contract from the National Science Foundation. The two-year project, Wafer-Scale, Hermetic Packaging of MEMS-Based Systems," is aimed toward development of a novel packaging method that will greatly simplify the packaging of MEMS and their associated electronics

06/21/2007  Recognizing that packaging and manufacturing are among the most crucial challenges facing MEMS engineers, ASM International has announced its MEMS Materials Database: Packaging Module to facilitate materials selection for MEMS packages.

03/26/2007  Quantum Leap boasts "industry breakthrough" in hermetic packaging

12/13/2006  SEMI put out a call for innovations for the fifth annual Technology Innovation Showcase (TIS) to be held in conjunction with SEMICON West 2007, July 17 – 19, 2007, in San Francisco. Nanotechnology, MEMS, test, assembly, packaging, and wafer processing submissions are sought by February 2, 2007.

06/06/2006  The day after I wrote my last editorial entitled Nano-inspiration, I attended the MEMS and Nanotechnology session at the IMAPS New England Symposium, May 16, in Boxborough, MA. There was so much discussion about nano-hype, multiple definitions of nano, how nanomaterials are made, and what you can do with them that I wished the session had occurred a few days earlier.

06/06/2006  (June 6, 2006) SAN JOSE, CA — If you're like most people who responded to SEMI's survey on MEMS packaging standards, you're not aware that SEMI has published three MEMS-related standards. Existing standards cover microscale fluidic systems, terminology, and wafer bonding. SEMI's MEMS technical committee has identified MEMS packaging as a task force area, and standardization efforts are just beginning.

03/11/2005 

02/11/2005  Each year, Small Times ranks the U.S. states for their research, development and commercialization proficiency in the areas of nanotechnology, MEMS and microsystems. Last year, Michigan ranked eighth. Its 2004 report card follows.

02/23/2004  Micralyne Inc., an Edmonton, Alberta, based MEMS manufacturer, has signed a contract worth more than $2 million to make components for chemical analysis instrumentation, according to a news release.

06/24/2003  Rainier Corp., a Princeton, Mass.-based public relations and advertising agency, has launched a MEMS practice, according to a news release.