Packaging and Testing

PACKAGING AND TESTING ARTICLES


Cellucci named Zyvex COO

01/06/2003  Thomas Cellucci has been promoted to chief operating officer at Zyvex Corp.
For MEMS, the key to lowering cost is all in the packaging

11/21/2002  Carsten Bahle of Wicht Technologie Consulting doesn’t mince words when it comes to the need to rethink MEMS packaging. “The biggest stumbling block to commercial success is the lack of general, simple and effective packaging techniques,” he said. The reason is simple: cost. Although these microsystems are getting smaller all the time, that doesn’t mean packaging costs are shrinking as well.
Palomar unveils MEMS packaging system

08/29/2002  Palomar Technologies, a California-based maker of precision assembly equipment, said it has launched an automated MEMS packaging system.
Measurement Specialties delays report, sells fab

07/15/2002 

COMPANY PROFILE: OMM INC.
LEADER IN 2-D MEMS TECHNOLOGY
WAITS FOR MARKET TO CATCH UP

04/22/2002 

MICHIGAN FOCUS ON WIRELESS MEMS A FIRST FOR NSF PROGRAM

05/08/2001 

Engineering Research Center is developing a large-scale treatment for deafness.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts