08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

07/28/2017  Three leading U.S. universities are the latest recipients of funding from the Nano-Bio Manufacturing Consortium (NBMC), operated by SEMI.

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

07/10/2017  Boston Semi Equipment (BSE), a global semiconductor test handler company, announced today it has received a follow on order for multiple Zeus gravity test handling systems for pressure MEMS.

06/28/2017  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, wearable systems, and other new uses will offset slow growth in camera phones, says O-S-D Report.

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.

06/20/2017  MEMS & Sensors Industry Group announces programs and speakers for SEMICON West 2017 (July 11-13).

06/16/2017  With the increasing sophistication of future vehicles, new and more advanced semiconductor technologies will be used and vehicles will become technology centers.

05/22/2017  Strong unit growth continues to be driven by the spread of automated embedded controls, wearable systems, and the Internet of Things, says new O-S-D Report.

04/27/2017  STMicroelectronics announced today the appointment of Jean-Marc Chery as Deputy CEO, effective July 1, 2017.

04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

03/13/2017  Over 60,000 attendees are expected at SEMICON China opening tomorrow at Shanghai New International Expo Centre (SNIEC).

03/01/2017  ULVAC Technologies, Inc. has been selected by a global MEMS inertial sensor manufacturer to deliver an ULVAC ENVIRO-1Xa advanced plasma ashing system for running critical low-temp descum processes and high-temp bulk photoresist strip processes.

02/21/2017  Today, the research and innovation hub in nanoelectronics and digital technology imec, and the Flemish Government announced a new, 5-year strategic commitment that aims at strengthening the pioneering role of Flanders' renowned research hub.

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

02/17/2017  Wafer bonding and 3D interconnect technology to enable delivery of next-generation MEMS and image sensor solutions.

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

02/03/2017  Qualcomm Incorporated and TDK Corporation today announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd.

01/27/2017  What follows, in Part 1 of this two-part article, is a quick look back at the industry in 2016 and the road ahead in 2017 followed by what SEMI achieved in 2016 and where SEMI’s road will lead in 2017 to keep pace our industry charging forward where there is no path.

01/25/2017  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2017.