Packaging Materials

PACKAGING MATERIALS ARTICLES



Chemical route towards electronic devices in graphene

07/25/2017  Essential electronic components, such as diodes and tunnel barriers, can be incorporated in single graphene wires (nanoribbons) with atomic precision.

IBM scientists observe elusive gravitational effect in solid-state physics

07/19/2017  An international team of physicists, materials scientists and string theoreticians have observed a phenomenon on Earth that was previously thought to only occur hundreds of light years away or at the time when the universe was born. This result could lead to a more evidence-based model for the understanding the universe and for improving the energy-conversion process in electronic devices.

Researchers find path to discovering new topological materials

07/19/2017  An international team of researchers has found a way to determine whether a crystal is a topological insulator -- and to predict crystal structures and chemical compositions in which new ones can arise.

Taiwan largest semiconductor materials market, as SEMICON Taiwan approaches

07/19/2017  Taiwan is the world's largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.

IC deposition materials market forecast of $1.2B by 2021

07/17/2017  Precursors for metals and dielectrics in strong demand for finFETs and 3D-NAND.

Industry acting to reduce greenhouse gases

07/13/2017  Semiconductor manufacturers use a variety of high global warming potential (GWP) gases to process wafers and to rapidly clean chemical vapor deposition (CVD) tool chambers.

New materials, new challenges

07/12/2017  In order to increase device performance, the semiconductor industry has slowly been implementing many new materials.

Meniscus-assisted technique produces high efficiency perovskite PV films

07/10/2017  A new low-temperature solution printing technique allows fabrication of high-efficiency perovskite solar cells with large crystals intended to minimize current-robbing grain boundaries.

Umicore inaugurates new production facility in Germany

06/29/2017  Umicore’s business unit Precious Metals Chemistry today inaugurated its production unit for advanced metal organic precursor technologies used in the semiconductor and LED markets.

Materials accelerating innovation at SEMI Strategic Materials Conference

06/14/2017  Today SEMI announced that the two-day Strategic Materials Conference (SMC) is slated for September 19-20 at San Jose's Doubletree by Hilton Hotel.

Researchers image quasiparticles that could lead to faster circuits, higher bandwidths

06/09/2017  A research team led by Iowa State University's Zhe Fei has made the first images of half-light, half-matter quasiparticles called exciton-polaritons. The discovery could be an early step to developing nanophotonic circuits that are up to 1 million times faster than current electrical circuits.

Artificial intelligence: A new era of the advanced packaging industry

06/08/2017  AI is driving the development of 3D TSV and heterogeneous integration technologies.

Supply chain needs paradigm shift in how to look at defect control

06/07/2017  The future of contamination control in the next-generation supply chain for beyond 14nm-node semiconductor processes faces stringent challenges.

New method of characterizing graphene

06/01/2017  Scientists have developed a new method of characterizing graphene's properties without applying disruptive electrical contacts, allowing them to investigate both the resistance and quantum capacitance of graphene and other two-dimensional materials. Researchers from the Swiss Nanoscience Institute and the University of Basel's Department of Physics reported their findings in the journal Physical Review Applied.

Volatility in electronic equipment supply chain

06/01/2017  SEMI’s year-to-date worldwide semiconductor equipment billings year-to-date through March show a 59.6 percent gain to the same period last year.

Next-gen solar cells could be improved by atomic-scale redesign

05/15/2017  Researchers have uncovered the exact mechanism that causes new solar cells to break down in air, paving the way for a solution.

Hafnia dons a new face

05/12/2017  As computer chips become smaller, faster and more powerful, their insulating layers must also be much more robust -- currently a limiting factor for semiconductor technology. A collaborative University of Kentucky-Texas A&M University research team says this new phase of hafnia is an order of magnitude better at withstanding applied fields.

Soitec names new VP of Strategic Business Development in China

05/11/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, has appointed Stephen Lin to the newly created position of vice president of strategic business development in China, a key region for the company's future growth plans.

At last: Beautiful, consistent carbon belts

05/11/2017  Synthesis of a carbon nanobelt with potential applications in nanotechnology.

Chemically tailored graphene

05/09/2017  Graphene is considered as one of the most promising new materials. However, the systematic insertion of chemically bound atoms and molecules to control its properties is still a major challenge. Now, for the first time, scientists of the Friedrich-Alexander-Universität Erlangen-Nürnberg, the University of Vienna, the Freie Universität Berlin and the University Yachay Tech in Ecuador succeeded in precisely verifying the spectral fingerprint of such compounds in both theory and experiment.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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