Packaging Materials

PACKAGING MATERIALS ARTICLES



Polymer-coated silicon nanosheets as an alternative to graphene

03/08/2017  Researchers at the Technical University of Munich (TUM) have, for the first time ever, produced a composite material combining silicon nanosheets and a polymer that is both UV-resistant and easy to process.

Coffee-ring effect leads to crystallization control

03/06/2017  Varying the thickness of crystallizing materials facilitates control over the patterns and properties of crystals.

Technavio reports top three drivers promoting growth for the carbon nanotube market

03/03/2017  Technavio analysts forecast the global carbon nanotube (CNT) market to grow at a staggering CAGR of almost 22% during the forecast period, according to their latest report.

Versum Materials expands manufacturing capacity

03/01/2017  Versum Materials, Inc. announced today that it would expand its manufacturing capacity at its Delivery Systems and Service (DS&S) headquarters in Allentown, Pennsylvania.

Materion Corporation completes Heraeus target materials acquisition

03/01/2017  Materion Corporation announced today that it has completed the previously announced acquisition of the target materials business of the Heraeus Group.

Researchers pave the way for ionotronic nanodevices

02/24/2017  Discovery helps develop a new kind of electrically switchable memories.

Versum Materials names Edward Shober as senior VP of Materials

02/24/2017  Versum Materials, Inc., a materials supplier to the semiconductor industry, announced today that Edward “Ed” Shober has been appointed to the position of senior vice president of its Materials segment.

SEMI appoints Ajit Manocha as president and CEO

02/21/2017  SEMI today announced the appointment of Ajit Manocha as its president and CEO.

Technologies to extend semiconductor scaling

02/20/2017  An Steegen reveals some of the secrets of semiconductor scaling – a pipeline full of materials, device architectures and advanced techniques that promise to further extend semiconductor scaling.

Breakthrough with a chain of gold atoms

02/17/2017  In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport.

'Lossless' metamaterial could boost efficiency of lasers and other light-based devices

02/17/2017  Engineers at the University of California San Diego have developed a material that could reduce signal losses in photonic devices.

A new spin on electronics

02/15/2017  Information transport by spin as an alternative to conventional computing technology.

Turning up the heat for perfect (nano)diamonds

02/14/2017  Researchers are taking rough, defective diamonds and using high temperatures to perfect them for quantum sensing.

A new platform to study graphene's electronic properties

02/13/2017  IBS scientists model the electronic structure of graphene.

Penn researchers are among the first to grow a versatile 2-dimensional material

02/09/2017  University of Pennsylvania researchers are now among the first to produce a single, three-atom-thick layer of a unique two-dimensional material called tungsten ditelluride.

Intel announces $7B investment in next-gen semiconductor fab in Arizona

02/09/2017  The announcement was made by U.S. President Donald Trump and Intel CEO Brian Krzanich at the White House.

NREL research pinpoints promise of polycrystalline perovskites

02/07/2017  A team of scientists from the Energy Department's National Renewable Energy Laboratory (NREL) determined that surface recombination limits the performance of polycrystalline perovskite solar cells.

Annual silicon volume shipments remain at record highs

02/07/2017  Revenues continue to be under pressure.

Towards new IT devices with stable and transformable solitons

02/06/2017  Multi-digit systems, solitonics and brain-like machines

Germanium outperforms silicon in energy efficient transistors with n- und p- conduction

02/03/2017  A team of scientists from the Nanoelectronic Materials Laboratory (NaMLab gGmbH) and the Cluster of Excellence Center for Advancing Electronics Dresden (cfaed) at the Dresden University of Technology have demonstrated the world-wide first transistor based on germanium that can be programmed between electron- (n) and hole- (p) conduction.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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