Packaging Materials

PACKAGING MATERIALS ARTICLES



New material with ferroelectricity and ferromagnetism may lead to better computer memory

12/21/2016  Scientists at Tokyo Institute of Technology (Tokyo Tech) have demonstrated that ferroelectricity and ferromagnetism coexist at room temperature in thin films of bismuth-iron-cobalt oxide. The research could have implications in the next generation of computer memory and sensors.

Semiconductor materials: restructuring in the supplier base

12/21/2016  Earlier this year, the Nikkei Asian Review (and other sources) reported the exit of Sumitomo Metal Mining (SMM) from the leadframe business.

Detecting fluorocarbons with infrared

12/21/2016  Detection and measurement of fluorocarbons is key to both process control and safety.

2D materials may be brittle

12/21/2016  Molybdenum-diselenide brittle, borophene not.

Researchers work to improve the lifecycle of materials

12/15/2016  When most living creatures get hurt, they can self-heal and recover from the injury. But, when damage occurs to inanimate objects, they don't have that same ability and typically either lose functionality or have their useful lifecycle reduced. Researchers at the Beckman Institute for Advanced Science and Technology are working to change that.

Rapid and mass production of graphene, using microwaves

12/13/2016  Graphene, a material that could usher in the next generation of electronic and energy devices, could be closer than ever to mass production, thanks to microwaves.

Stanford engineers find that a new memory technology may be more energy efficient than previously thought

12/07/2016  While exploring the atomic-level forces at play in a new type of computer chip, researchers found an energy-saving surprise that could translate into longer battery life for next-generation mobile devices.

3-D solutions to energy savings in silicon power transistors

12/05/2016  K Tsutsui at Tokyo Institute of Technology and colleagues in Japan have now shown that by scaling down size parameters in all three dimensions their device they can achieve significant energy savings.

Making graphene using laser-induced phase separation

12/02/2016  IBS & KAIST researchers clarify how laser annealing technology can lead to production of ultra thin nanomaterials.

Physicists decipher electronic properties of materials in work that may change transistors

12/02/2016  University of Texas at Dallas physicists have published new findings examining the electrical properties of materials that could be harnessed for next-generation transistors and electronics.

Creating new physical properties in materials

11/30/2016  Collaborating German institutions bring complementary expertise to demonstrate piezoelectricity in SrTiO3.

Global carbon nanotubes market to grow at 17.9% CAGR through 2025

11/22/2016  The global market for nanotubes was valued at $1,250.00 million in 2015 and is expected to grow at a CAGR of 17.9% during the forecast period 2016-2025.

UCR researchers discover new method to dissipate heat in electronic devices

11/14/2016  By modulating the flow of phonons through semiconductor nanowires, engineers can create smaller and faster devices.

Nano-scale electronics score laboratory victory

11/10/2016  NYU Tandon researchers pioneer technique to grow monolayer tungsten disulfide for next-generation transistors, wearable electronics, and biomedical devices.

Studying structure to understand function within 'material families'

11/09/2016  Researchers are running structural studies using extensive numerical simulations on a supercomputer to study the motion of more than 500 atoms -- in an effort to determine the forces on each atom and the total energy via density functional calculations.

Semiconductor-free microelectronics are now possible, thanks to metamaterials

11/09/2016  Engineers at the University of California San Diego have fabricated the first semiconductor-free, optically-controlled microelectronic device.

Third quarter 2016 silicon wafer shipments set a new record

11/09/2016  Worldwide silicon wafer area shipments increased during the third quarter 2016 when compared to second quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

New record for silicon-based multi-junction solar cell

11/09/2016  Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with the Austrian company EV Group (EVG) have successfully manufactured a silicon-based multi-junction solar cell with two contacts and an efficiency exceeding the theoretical limit of silicon solar cells.

SunEdison Semiconductor announces regulatory approvals from Taiwan and Austria for proposed acquisition

11/07/2016  SunEdison Semiconductor Limited announced today that it has received notice that the Investment Committee of the Ministry of the Economic Affairs of the Republic of China has approved the proposed acquisition of SunEdison Semiconductor by GlobalWafers Co., Ltd.

'Pressure-welding' nanotubes creates ultrastrong material

11/07/2016  Scientists at MIPT apply torsion to multiwall nanotubes to form bonds between them creating durable material.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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