Packaging Materials

PACKAGING MATERIALS ARTICLES



Monolithic Schottky diode in ST F7 LV MOSFET technology: Performance improvement in application

05/11/2016  Standard solutions and devices are compared to a 60 V MOSFET with monolithic Schottky diode as evaluated in SMPS and motor control environments.

Novel functionalized nanomaterials for CO2 capture

05/10/2016  Climate change due to excessive CO2 levels is one of the most serious problems mankind has ever faced. CO2 emissions need to be reduced urgently to avoid potentially dangerous and irreversible effects of climate change. To mitigate such emissions, CO2 capture is one of the best solutions. Scientists at the Tata Institute of Fundamental Research, Mumbai, have developed novel functionalized nanomaterials that can capture CO2 with superior capture capacity and stability over conventional sorbents.

Researchers integrate diamond/boron nitride crystalline layers for high-power devices

05/10/2016  Materials researchers at North Carolina State University have developed a new technique to deposit diamond on the surface of cubic boron nitride (c-BN), integrating the two materials into a single crystalline structure.

Global semiconductor sales increase slightly in March

05/06/2016  The Semiconductor Industry Association (SIA) this week announced worldwide sales of semiconductors reached $26.1 billion for the month of March 2016, a slight increase of 0.3 percent compared to the previous month's total of $26.0 billion.

Packaging materials: Strong growth rates for small form factors

04/13/2016  While much of the recent attention has been focused on the growth of wafer level packages (WLPs), specifically fan-out WLPs, this is not the only segment forecast to undergo strong unit growth.

TowerJazz announces its SiGe Terabit Platform

04/05/2016  TowerJazz, the global specialty foundry, today announced its SiGe Terabit Platform targeting high-speed wireline communications for the terabit age.

IEEE Photonics Society's Issues Call for Papers for 13th International Group IV Photonics Conference

04/04/2016  The 2016 International Group IV Photonics Conference, sponsored by the IEEE Photonics Society, has announced the Call for Papers seeking original research on the Novel Materials & Nanophotonics; Photonic Devices; and Silicon Photonics Applications & Systems.

Pumping up energy storage with metal oxides

03/21/2016  Material scientists at Lawrence Livermore National Laboratory have found certain metal oxides increase capacity and improve cycling performance in lithium-ion batteries.

GLOBALFOUNDRIES broadens SiGe power amplifier portfolio

03/15/2016  GLOBALFOUNDRIES today announced new advanced radio-frequency (RF) silicon solutions, further expanding the portfolio of Silicon Germanium (SiGe) power amplifier (PA) technologies designed to enable performance-optimized cellular and Wi-Fi solutions in increasingly sophisticated mobile devices and hardware.

FUJIFILM Electronic Materials receives Intel's Supplier Continuous Quality Improvement Award

03/11/2016  FUJIFILM Electronic Materials has been recognized as one of eight companies receiving Intel Corporation's prestigious Supplier Continuous Quality Improvement (SCQI) award for their performance in 2015.

Building a better mouse trap, from the atoms up

03/07/2016  For most of human history, the discovery of new materials has been a crapshoot. But now, UConn researchers have systematized the search with machine learning that can scan millions of theoretical compounds for qualities that would make better solar cells, fibers, and computer chips. The search for new materials may never be the same.

NREL collaboration boosts potential for CdTe solar cells

03/02/2016  A critical milestone has been reached in cadmium telluride (CdTe) solar cell technology, helping pave the way for solar energy to directly compete with electricity generated by conventional energy sources.

New technique for turning sunlight into hydrogen

02/16/2016  A team of Korean researchers, affiliated with UNIST has recently pioneered in developing a new type of multilayered (Au NPs/TiO2/Au) photoelectrode that boosts the ability of solar water-splitting to produce hydrogen.

Engineering material magic

02/15/2016  University of Utah engineers have discovered a new kind of 2D semiconducting material for electronics that opens the door for much speedier computers and smartphones that also consume a lot less power.

The iron stepping stones to better wearable tech without semiconductors

02/05/2016  The road to more versatile wearable technology is dotted with iron. Specifically, quantum dots of iron arranged on boron nitride nanotubes (BNNTs).

A new approach to chip fabrication

01/29/2016  MIT researchers and their colleagues report the first chip-fabrication technique that enables significantly different materials to be deposited in the same layer.

Switchable material could enable new memory chips

01/20/2016  Two MIT researchers have developed a thin-film material whose phase and electrical properties can be switched between metallic and semiconducting simply by applying a small voltage.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

Wide Band Gap technologies: An opportunity to increase power devices performance

01/08/2016  When people think about Wide Band Gap (WBG) materials for power electronics applications, they usually think of GaN or SiC. However, there are materials with an even larger band gap which can further increase power device performance.

New device uses carbon nanotubes to snag molecules

12/22/2015  Engineers at MIT have devised a new technique for trapping hard-to-detect molecules, using forests of carbon nanotubes.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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