Packaging Materials

PACKAGING MATERIALS ARTICLES



TowerJazz to showcase SiGe and silicon photonic process solutions for 100 to 400Gb/s optical data links at ECOC

08/21/2018  The Company will showcase its advanced SiGe (Silicon Germanium) process, with speeds in excess of 300GHz, and its newest production SiPho (Silicon Photonics) process built into data center high-speed optical data links.

A valley so low: Electrons congregate in ways that could be useful to 'valleytronics'

08/20/2018  A Princeton-led study has revealed an emergent electronic behavior on the surface of bismuth crystals that could lead to insights on the growing area of technology known as "valleytronics."

Most wear-resistant metal alloy in the world engineered at Sandia National Laboratories

08/16/2018  Sandia's materials science team has engineered a platinum-gold alloy believed to be the most wear-resistant metal in the world.

For UW physicists, the 2-D form of tungsten ditelluride is full of surprises

08/10/2018  The general public might think of the 21st century as an era of revolutionary technological platforms, such as smartphones or social media. But for many scientists, this century is the era of another type of platform: two-dimensional materials, and their unexpected secrets.

Yale-NUS scientist and collaborators solve open theoretical problem on electron interactions

08/10/2018  The discovery will help scientists better understand electron interaction in new materials, paving the way for developing advanced electronics such as faster processors.

Tying down electrons with nanoribbons

08/08/2018  'Topological' graphene nanoribbons trap electrons for new quantum materials

Nanotube 'rebar' makes graphene twice as tough

08/06/2018  Rice University scientists test material that shows promise for flexible electronics.

'Strange metals' just got stranger

08/03/2018  A material already known for its unique behavior is found to carry current in a way never before observed.

Leti and CMP announce world's first multi-project wafer service with integrated silicon OxRAM

08/02/2018  Leti, a research institute at CEA Tech, and CMP, a service organization that provides prototyping and low-volume production of ICs and MEMS, today announced the integrated-circuit industry's first multi-project-wafer (MPW) process for fabricating emerging non-volatile memory OxRAM devices on a 200mm foundry base-wafer platform.

Optical secrets of disulfide nanotubes are disclosed by Lomonosov MSU Scientists

08/01/2018  They have demonstrated a strong light-matter interaction in suspensions and self-assembled films of tungsten disulfide nanotubes.

A colossal breakthrough for topological spintronics

07/31/2018  BiSb expands the potential of topological insulators for ultra-low-power electronic devices.

EPFL uses excitons to take electronics into the future

07/27/2018  EPFL researchers have developed a transistor based on excitons -- a type of particle most people have not heard of -- that is able to function at room temperature.

Theorists find mechanism behind nearly pure nanotubes from the unusual catalyst

07/27/2018  Growing a batch of carbon nanotubes that are all the same may not be as simple as researchers had hoped, according to Rice University scientists.

And then there was (more) light: Researchers boost performance quality of perovskites

07/26/2018  In a paper published online this spring in the journal Nature Photonics, scientists at the University of Washington report that a prototype semiconductor thin-film has performed even better than today's best solar cell materials at emitting light.

Semiconductor Research Corporation releases $26M in new research funds

07/26/2018  JUMP program funds 24 new research projects to amplify mission of its six innovation centers.

Applied Materials team selected by DARPA to develop advanced technology for artificial intelligence

07/24/2018  Applied Materials, Inc. today announced it has been awarded a contract by the Defense Advanced Research Projects Agency (DARPA) to develop a new type of electronic switch for artificial intelligence that mimics the way the human brain works to enable dramatic improvements in performance and power efficiency.

Apple is changing GaAs' future

07/23/2018  3D sensing in mobile phone as well as LiDAR’s applications are giving a new breath for GaAs substrates suppliers.

SEMI China Equipment & Materials Committee meeting targets region's semiconductor industry growth

07/20/2018  Storage and memory chipmaker and SEMI China member Tsinghua Unigroup is gearing up to meet burgeoning product demand with huge investments in its manufacturing plants.

Puzzling results explained: A multiband approach to Coulomb drag and indirect excitons

07/19/2018  A new theoretical study explains previous mystifying experimental results, in which coupled charged particles moved in exactly the opposite direction to that predicted. This apparently contradictory phenomenon is associated with the bandgap in dual-layer graphene structures, a bandgap which is very much smaller than in conventional semiconductors.

UCLA engineers develop world's most efficient semiconductor for thermal management

07/19/2018  New material draws heat away from hotspots much faster than current materials.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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