Packaging Materials

PACKAGING MATERIALS ARTICLES



Cree licenses GaN power patents to Nexperia

04/12/2018  Cree, Inc. announces that it signed a non-exclusive, worldwide, royalty-bearing patent license agreement with Nexperia BV, a Dutch company.

Mechanism of oxidative unzipping of multiwall carbon nanotubes to graphene nanoribbons

04/12/2018  While the bottom-up method provides a route to precise edge control, and the lithographic method can afford GNRs with precise placement, the unzipping method has the advantage of mass-production on a large scale.

Indium Corporation receives ON Semiconductor Award for "Perfect Quality"

04/10/2018  Indium Corporation, one of more than 3,000 ON Semiconductor production suppliers, was selected for its commitment to ensuring high quality and supply continuity in an evolving semiconductor market.

Diamond-based circuits can take the heat for advanced applications

04/10/2018  Researchers at Japan's National Institute for Materials Science developed a hydrogenated diamond circuit operational at 300 degrees Celsius.

U.S. federal government R&D spending for 2018 finalized

04/06/2018  Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown of the year.

High-speed and on-silicon-chip graphene blackbody emitters

04/03/2018  Integrated light emitters for optical communications.

Exploring the thermoelectric properties of tin selenide nanostructures

03/27/2018  Researchers discover that nanometer-thick tin selenide crafted in thin films of connected 'nanoflakes' shows promise for thermoelectric energy conversion.

Improving human-data interaction to speed nanomaterials innovation

03/26/2018  New application of data analysis, visualization techniques achieves better representation of multidimensional materials data; Work is part of Lehigh University's initiative to accelerate understanding of materials through improved human-data interaction

Electric textile lights a lamp when stretched

03/22/2018  Working up a sweat from carrying a heavy load? That is when the textile works at its best. Swedish researchers have developed a fabric that converts kinetic energy into electric power. The greater the load applied to the textile and the wetter it becomes the more electricity it generates.

High-performance, cost-effective, thin-film solar cell technology provides an attractive source of portable and mobile power

03/22/2018  Magnolia Optical Technology, Inc. announced that it is working with the Defense Advanced Research Projects Agency (DARPA) under the Phase II SBIR Program for Development of High-Performance Thin-Film Solar Cells for Portable Power Applications.

'Candy cane' polymer weave could power future functional fabrics and devices

03/21/2018  If scientists are going to deliver on the promise of implantable artificial organs or clothing that dries itself, they'll first need to solve the problem of inflexible batteries that run out of juice too quickly. Today, researchers report that they've developed a new material by weaving two polymers together in a way that increases charge storage capacity.

A future colorfully lit by mystifying physics of paint-on semiconductors

03/19/2018  Some novel materials that sound too good to be true turn out to be true and good. An emergent class of semiconductors, which could affordably light up our future with nuanced colors emanating from lasers, lamps, and even window glass, could be the latest example.

The ConFab 2018 announces conference agenda and speakers

03/16/2018  Browse this slideshow for a look at this year's speakers, keynotes, panel discussions, and special guests.

Chemists use abundant, low-cost and non-toxic elements to synthesize semiconductors

03/15/2018  Javier Vela of Iowa State University and the Ames Laboratory has worked with two of his graduate students to synthesize a new material for semiconductors. The chemists think the material will work well in solar cells, but without the toxicity, scarcity or costs of other semiconductors. They report their discovery in a paper recently published online by the Journal of the American Chemical Society.

Si2 approves two IC design simulation standards for fast-growing gallium nitride market

03/14/2018  The Silicon Integration Initiative's (Si2) Compact Model Coalition (CMC) has approved two integrated circuit design simulation standards that target the fast-growing global market for gallium nitride semiconductors.

Flat gallium joins roster of new 2-D materials

03/12/2018  Scientists at Rice University and the Indian Institute of Science, Bangalore, have discovered a method to make atomically flat gallium that shows promise for nanoscale electronics.

Simulation and experiment help TU Dresden researchers study next-generation semiconductors

03/08/2018  Theoretical physicists and experimentalists collaborate to identify dopants capable of enabling new designs of semiconducting materials.

Linde LienHwa announces investment commitment in China and additional new special gas production in Taiwan

03/07/2018  Linde LienHwa, a key supplier of gases and chemicals to the electronics industry, continues to invest with its customers in Mainland China and Taiwan.

Researchers reshape the energy landscape of phonons in nanocrystals

03/07/2018  Light and vibrations intertwine inside a nanoscale cavity.

Materials 'sandwich' breaks barrier for solar cell efficiency

03/05/2018  NYU Tandon Professor André D. Taylor's research team combines materials and borrows lessons from nature to build a better organic solar cell.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts