Packaging Materials


Exploring the structure and properties of new graphene-like polymers

11/02/2018  A team of scientists from Siberian Federal University (SibFU) together with foreign colleagues described the structural and physical properties of a group of two-dimensional materials based on polycyclic molecules called circulenes.

2D magnetism: Atom-thick platforms for energy, information and computing research

11/01/2018  Scientists say the tiny 'spins' of electrons show potential to one day support next-generation innovations in many fields.

Ultrasensitive toxic gas detector

10/31/2018  In a paper published in NANO, researchers from the School of Microelectronics in Tianjin University have discovered a two-step sputtering and subsequent annealing treatment method to prepare vertically aligned WO3-CuO core-shell nanorod arrays which can detect toxic NH3 gas.

Global semiconductor sales in September up 13.8% year-to-year

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

Nanotubes may give the world better batteries

10/26/2018  Rice U. scientists' method quenches lithium metal dendrites in batteries that charge faster, last longer.

Air Liquide inaugurates new advanced materials production facility in U.S.

10/24/2018  Air Liquide holds a ribbon cutting ceremony for the grand opening of its new advanced materials production facility in Upper Mount Bethel, Pennsylvania.

Deformation of nanotubes to control conductivity

10/23/2018  Scientists from the NUST MISIS Laboratory of Inorganic Nanomaterials together with their international colleagues have proved it possible to change the structural and conductive properties of nanotubes by stretching them. This can potentially expand nanotubes' application into electronics and high-precision sensors such as microprocessors and high-precision detectors.

GaN semiconductor specialist Exagan forms Taiwan subsidiary

10/18/2018  Exagan, an innovator of gallium nitride (GaN) semiconductor technology enabling smaller and more efficient electrical converters, has established Exagan Taiwan Ltd. with a new sales and applications center in Taiwan.

Exploring new spintronics device functionalities in graphene heterostructures

10/18/2018  Graphene Flagship researchers have shown in a paper published in Science Advances how heterostructures built from graphene and topological insulators have strong, proximity induced spin-orbit coupling which can form the basis of novel information processing technologies.

Controlling organic semiconductor band gaps by electron-acceptor fluorination

10/17/2018  Researchers from Osaka University develop a fluorinated electron-acceptor unit for high performance organic semiconductors.

Electrical enhancement: Engineers speed up electrons in semiconductors

10/17/2018  Researchers from Graduate School of Bio-Applications and Systems Engineering at Tokyo University of Agriculture and Technology (TUAT) have sped up the movement of electrons in organic semiconductor films by two to three orders of magnitude. The speedier electronics could lead to improved solar power and transistor use across the world, according to the scientists.

Hidden gapless states on the path to semiconductor nanocrystals

10/12/2018  When chemists from the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw were starting work on yet another material designed for the efficient production of nanocrystalline zinc oxide, they didn't expect any surprises. They were greatly astonished when the electrical properties of the changing material turned out to be extremely exotic.

Researchers quickly harvest 2-D materials, bringing them closer to commercialization

10/12/2018  Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics.

Research on light-matter interaction could improve electronic and optoelectronic devices

10/11/2018  Fundamental research sheds light on new many-particle quantum physics in atomically thin semiconductors.

Study opens route to flexible electronics made from exotic materials

10/10/2018  Cost-effective method produces semiconducting films from materials that outperform silicon.

DRAM market braces for slower growth

10/03/2018  History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans.

Transition metal dichalcogenides could increase computer speed, memory by a million times

10/03/2018  Transition metal dichalcogenides (TMDCs) possess optical properties that could be used to make computers run a million times faster and store information a million times more energy-efficiently, according to a study led by Georgia State University.

Picosun-SINANO collaboration yields excellent TiN process

09/26/2018  Picosun Group and Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO) report excellent quality titanium nitride (TiN) deposited with Picosun’s plasma-ALD technology.

Study demonstrates new mechanism for developing electronic devices

09/26/2018  OIST scientists have demonstrated a new mechanism that may help develop electronic devices differently.

UIC chemical engineers first to functionalize boron nitride with other nanosystems

09/25/2018  Researchers unlock potential for improving composite material.


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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