05/31/2018  Global sales of smartphones to end users returned to growth in the first quarter of 2018 with a 1.3 percent increase over the same period in 2017, according to Gartner, Inc.

05/31/2018  New President & CEO Jean-Marc Chery to lead newly formed Executive Committee.

05/30/2018  Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends.

05/29/2018  TowerJazz, the global specialty foundry leader, and Gpixel, Inc., a fast-growing CMOS image sensor (CIS) provider focusing on professional applications, announced today that Gpixel's GMAX0505.

05/25/2018  The global substrate-like PCB market will grow at a CAGR of over 7% during the forecast period, according to Technavio analysts.

05/24/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it will be expanding its Silicon Carbide (SiC) MOSFET and SiC diode product portfolios early next quarter, including samples of its next-generation 1200-volt (V), 25 mOhm and 80 mOhm SiC MOSFET devices.

05/23/2018  Veeco Instruments Inc. announced that Lumentum Holdings Inc. has ordered the Veeco K475i™Arsenide/Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for production of its advanced semiconductor components.

05/22/2018  The 64th annual IEEE International Electron Devices Meeting(IEDM), to be held at the Hilton San Francisco Union Square hotel December 1-5, 2018, has issued a Call for Papers seeking the world's best original work in all areas of microelectronics research and development.

05/22/2018  Memory devices employ a wide range of packaging technology from wire-bond leadframe and BGA to TSV.

05/22/2018  U.S. electronics manufacturing event expands with wearables program.

05/21/2018  Micron Technology, Inc. (Nasdaq:MU), and Intel Corporation today announced production and shipment of the industry's first 4bits/cell 3D NAND technology.

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

05/17/2018  For the 20th year, a worldwide survey of semiconductor manufacturers has resulted in Plasma-Therm winning multiple awards for its systems and superior customer service.

05/17/2018  New Hampshire company specializes in high-end FPGA computing platforms designed to improve performance and time-to-revenue for OEMs.

05/17/2018  In response to the European Commission’s (EC) proposed framework for screening foreign direct investments (FDI), SEMI, representing the global electronics manufacturing supply chain, offers three recommendations for consideration by EU policymakers.

05/16/2018  Companies announce strategic collaboration to integrate ReRAM technology in Microsemi products.

05/16/2018  A Columbia University-led international team of researchers has developed a technique to manipulate the electrical conductivity of graphene with compression, bringing the material one step closer to being a viable semiconductor for use in today's electronic devices.

05/15/2018  Synopsys, Inc. today announced that GLOBALFOUNDRIES (GF) has certified the Synopsys IC Validator tool for physical signoff on the GF 14LPP process technology.

05/15/2018  Presto Engineering Inc. today announced that it has joined GLOBALSOLUTIONS, GF's ecosystem of partners that provides services from conception to production.

05/09/2018  TowerJazz, the global specialty foundry leader, and Newsight Imaging, today announced production of Newsight's advanced CMOS image sensor (CIS) chips and camera modules, customized for very high volume LiDAR and machine vision markets, combining sensors, digital algorithms and pixel array on the same chip.