05/02/2013 

The worldwide semiconductor assembly and test services (SATS) market totaled $24.5 billion in 2012, a 2.1 percent increase from 2011, according to final results from Gartner, Inc.

05/01/2013 

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.

04/29/2013 

Rudolph Technologies, Inc. announced today that it has purchased selected assets, including a patent portfolio, relating to metrology capability from Tamar Technology, Newbury Park, Calif.

04/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.

04/18/2013 

With time running out until U.S. component manufacturers are legally required to disclose their usage of conflict minerals to the federal government, many companies are woefully unprepared for the new regulations, with more than one-third of firms indicating they haven’t even commenced compliance planning, according to a survey from information and analytics provider IHS.

04/11/2013 

Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.

04/11/2013 

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

04/10/2013 

 Electro Scientific Industries, Inc. today announced it had signed a definitive agreement to acquire the Semiconductor Systems business of GSI Group, Inc., a supplier of precision photonics, laser-based solutions and precision motion devices to the medical, industrial, scientific, and electronics markets

04/09/2013 

Alliance Memory today extended its 128M and 256M lines of high-speed CMOS synchronous DRAMs (SDRAM) with new devices in a 54-ball 8 mm by 8mm by 1.2mm TFBGA package.

04/09/2013 

Silex Microsystems and BroadPak today announced the immediate availability of their jointly developed silicon interposer solution in high-volume manufacturing.

04/03/2013 

The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.

04/02/2013 

GLOBALFOUNDRIES today announced the accomplishment of a key milestone in its strategy to enable 3D stacking of chips for next-generation mobile and consumer applications.

03/21/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.

03/20/2013 

Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.

03/18/2013 

FlipChip International (FCI), a developer of flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s. announced a partnership agreement today.

03/15/2013 

In 2012, global PCB industry saw a jump in terms of output value, benefitting in a large part from the rapid growth in the shipment of Apple and Samsung. However, there is no such possibility of a huge jump in 2013, as the report states the expected growth rate will slow down to 2.7%.

03/15/2013 

OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.

03/13/2013 

Foundry to use wafers for 3D IC and advanced packaging volume production applications.

03/12/2013 

Signetics Corporation today introduced their new MapBGA package to the industry. This alternative to standard PBGA packaging has improved reliability and design flexibility due to its unique assembly process.

03/12/2013 

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.