03/07/2013 

LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.

03/06/2013  eMemory announced today that the accumulated number of customers’ wafers incorporating eMemory’s eNVM SIPs have now surpassed 5 million production mark.

03/06/2013 

Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around $31.7 billion, increasing to $39.3 billion in 2014 — a 24% increase.

03/05/2013 

EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it is developing equipment and process technology to enable covalent bonds at room temperature.

03/05/2013 

Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology

03/04/2013 

Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018.

02/28/2013 

This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.

02/28/2013 

Brooks Instrument, a provider of flow measurement and control instrumentation to the microelectronics industry, will launch the GF135 pressure transient insensitive (PTI) mass flow controller at SEMICON China, March 19-21 at Shanghai New International Expo Center.

02/26/2013 

New marketing and technical support center opened in Reading, UK.

02/26/2013 

Engineered Material Systems, a global supplier of electronic materials for circuit assembly applications, debuts its DB-1568-1 low-temperature cure die attach adhesive for attaching semiconductor die in temperature-sensitive devices.

02/25/2013 

The competitive landscape of the cellphone core integrated circuit (IC) business has completely transformed over the past five years, with Qualcomm Inc. and Samsung capitalizing on the rise of smartphones and 4G.

02/25/2013 

Silicon nanocrystals have a size of a few nanometers and possess a high luminous potential. Scientists of Karlsruhe Institute of Technology (KIT) and the University of Toronto/Canada have now succeeded in manufacturing silicon-based light-emitting diodes (SiLEDs). They are free of heavy metals and can emit light in various colors.

02/22/2013 

Only light, aerial oxygen, and a catalyst are needed to remove pollutants from water. Ruhr-Universitat Bochum researchers led by Professor Radim Beránek are collaborating with colleagues from seven different countries in order to develop a photocatalyst that is efficient enough to be profitable.

02/22/2013 

The ability to improve silicon transistors is reaching its fundamental limit, so researchers are searching for new ways to keep making electronic devices faster and more powerful. University of Nebraska-Lincoln physicists and colleagues have taken a major step toward breaking that silicon barrier.

02/21/2013 

At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.

02/21/2013 

Tim Turner, the Reliability Center Business Development Manager at the College of Nanoscale Science and Engineering (CNSE), Albany, NY, blogs about the potential of resistive memory and the reliability challenges the must be overcome.

02/20/2013 

CEA-Leti today announced that it will coordinate a four-year project aimed at building a European-based supply chain in silicon photonics and speeding industrialization of the technology.

02/20/2013 

Joint effort to explore novel process techniques to improve device performance and reliability in semiconductor manufacturing for sub 20nm technology node.

02/20/2013 

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.

02/20/2013 

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.