Packaging

PACKAGING ARTICLES


2013: Building the internet of things with MEMS and 3D advances

01/02/2013 

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.

2013: Fab Equipment Spending Shrinks Back to Flat

01/02/2013 

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.

Semi execs see a bright 2013, says survey

12/28/2012 

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.
Lifting the veil on silicon interposer pricing

12/24/2012 

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.
Gartner: Fab equipment still getting softer, next upcycle starts in 2014

12/20/2012 

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.
Singapore IME launches 2.5D silicon interposer MPW

12/19/2012 

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.
Samsung reaffirms plans for $4B investment in Austin fab: What it means

12/17/2012 

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.
Tezzaron licenses Ziptronix's bonding tech for 3D memory

12/17/2012 

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.
Rudolph enters back-end lithography market

12/13/2012 

Rudolph Technologies, Inc. (Nasdaq: RTEC) has entered the back-end advanced packaging lithography market, with the acquisition of Azores Corp., and the introduction of a new 2X reduction stepper called the JetStep.
#11: Fastest Ge p-MOSFET

12/11/2012 

#10: Visualizing CBRAM Filaments

12/11/2012 

#9: Record Silicon Nanowire MOSFETs

12/11/2012 

#8: 300mm wafer-scale Ge FinFET

12/11/2012 

#7: Hybrid Nanowire/CMOS Biosensor

12/11/2012 

#6: Novel Nanopore Sensor for DNA Sequencing

12/11/2012 

#5: Nanofluidic Channels for Lab-on-Chip

12/11/2012 

#4: Monolithic 3D Chip

12/11/2012 

#3: TSMC’s Integrated 16nm FinFET Technology Platform

12/11/2012 

#2: Thermally Stable Magnetic Tunnel Junction Memory

12/11/2012 

#1: Triangular MOSFETs with InGaAs Channels

12/11/2012 




WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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