Packaging

PACKAGING ARTICLES



Process Watch: Cycle time’s paradoxical relationship to inspection

12/11/2012 

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

IEDM: Nanoelectronics provide a path beyond CMOS

12/11/2012 

At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.

IEDM keynote: It tastes like chicken

12/11/2012 

Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”

SEMI: Chip equipment slump extending into 2013, across-the-board rebound in 2014

12/06/2012 

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.

IEDM 2012 slideshow: Sneak preview of 14 conference papers

12/04/2012 

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.

Advanced non-etching adhesion promoters eliminate interposer layer

11/28/2012 

New NEAPs are independent of the adhesion performance of various types of dielectric materials, and the new NEAP process adds surface area to the conductors.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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