Packaging

PACKAGING ARTICLES

Tessera receives initial Amkor payment in court award

08/21/2012

Tessera received an initial payment of approximately $20 million from semiconductor packaging company Amkor, related to the interim award issued by the International Court of Arbitration of the International Chamber of Commerce (ICC).

Assembleon adds wafer handling to its flip-chip bonder

08/20/2012

Assembl

Wafer-level packaging start-up Deca Technologies appoints leader for Philippines

08/17/2012

Deca Technologies, wafer-level packaging (WLP) services to the semiconductor industry, added Iain Meikle as VP of operations and managing director in the Philippines.

See 3mil wire bonding at IMAPS with Hesse & Knipps

08/16/2012

Hesse & Knipps Inc. will demo a new 3mil wire bonding capability on its BJ935 automatic heavy wire bonder for back-end semiconductor packaging at IMAPS in San Diego.

Tessera changes CFO, Neely brings high-tech experience

08/16/2012

Tessera appointed Rick Neely, Jr. as EVP and CFO, responsible for the company

MEMS Industry Group plans webinars on fab challenges, applications, more

08/15/2012

The MEMS Industry Group (MIG) is planning webinars on micro electro mechanical systems (MEMS) from packaging challenges to how MEMS can benefit healthcare.

Hybrid Memory Cube interface specification draft includes protocol, short-reach PHY interconnection

08/15/2012

The Hybrid Memory Cube Consortium released the initial draft of the Hybrid Memory Cube (HMC) interface specification, with the final version planned for end of 2012.

Kulicke & Soffa drives semiconductor packaging tool quality with new CQO

08/15/2012

Kulicke & Soffa Industries, Inc. (K&S, NASDAQ:KLIC) appointed Irene Lee to the role of chief quality officer. Lee will oversee quality assurance functions across Kulicke & Soffa

Fabless Monolithic Power Systems implements yieldWerx test and yield management

08/14/2012

Monolithic Power Systems (MPS) implemented yieldWerx Semiconductor Test and Yield Management tools. MPS required a robust and centralized system for effective storage, analysis, and sharing of testing and product data received from multiple foundries, assembly, and testing facilities in the US and Asia.

Laser nanofabrication for mass production at the nanoscale

08/10/2012

Laser nanofabrication can now meet the needs of submicron and nanoscale feature size manufacturing, and can operate in air, vacuum, or liquid processes. Sister publication Industrial Laser Solutions recently published Laser nanofabrication: A route toward next-generation mass production.

Supply chain readiness in an era of accelerated change

08/10/2012

In this SEMI News and Views blog, Karen Savala covers EUV lithography, 450mm wafers, and 3D IC developments, based on her recent presentation at SEMICON West, Supply Chain Readiness in an Era of Accelerated Change.

Integrating power electronics design technologies

08/09/2012

The field of power electronics, the application of electronics for the control and conversion of electric power, is underpinned by basic electrical principles that were established in the distant past by the pioneers of electrical science. But today, the need to supply, modify and control the voltage, current or frequency of electric power arises in a vast number of applications and products spanning a huge range in terms of power handling capability.

ASE tests NCKU lower-cost packaging solder as better than SAC

08/09/2012

Researchers at National Cheng Kung University (NCKU) in southern Taiwan developed a tin/zinc/silver/aluminum/gallium solder alloy for semiconductor packaging, which was tested by ASE.

Flooding in the Philippines threatens microelectronics facilities

08/09/2012

Heavy monsoons moving through the Philippines are causing floods in and around Manila, the capital. The Philippines is a small but growing area for microelectronics manufacturing and packaging facilities.

Multitest test handler adds 2D code reader option for traceability

08/08/2012

Multitest, semiconductor test equipment supplier, added a 2D code reader option to its MT2168 pick-and-place test handler, for package test customers that require 100% device traceability and lot integrity.

Henkel underfill reduces warpage for thinner flip chip packages

08/08/2012

Henkel Electronic Materials developed a new underfill system designed to reduce flip chip package stress by controlling die and substrate warpage, LOCTITE ECCOBOND UF 8840.

ASIC developers can now access multi-project wafer runs at Tektronix Component Solutions

08/08/2012

Tektronix Component Solutions, a custom microelectronics services provider, tapped supply chain aggregator MOSIS to help its customers develop complete, high-performance ASICs with lower early-stage ASIC development costs.

Agilent

08/07/2012

Agilent debuted its compliance test application, Agilent N6462A DDR4, for systems using DDR4 memory.

Zuken improves FPGA/ASIC co-design with PCBs in CR-5000

08/03/2012

Zuken updated its CR-5000 design software to version 14, with greater collaboration in FPGA development and targeting high-speed design. Many enhancements have also been included in CR-5000 Lightning, Zuken

The ConFab 2012: A retrospective

08/02/2012

The ConFab, Solid State Technologys invitation-only event for the semiconductor industry, took place in June, with presenters from top companies and analyst firms. If you couldnt be there, check out all the coverage from the event -- reports, presentations, video interviews and more.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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