Packaging

PACKAGING ARTICLES



Silvaco announces relocation of headquarters within Santa Clara

05/09/2018  Silvaco, an EDA and IP provider of software tools, announced today that it has moved into new corporate headquarters at 2811 Mission College Boulevard on the sixth floor of one of the towers of the Mission Corporate Center in the heart of Silicon Valley in Santa Clara.

Cohu to acquire Xcerra

05/08/2018  Cohu, Inc. and Xcerra Corporation today announced they have entered into a definitive merger agreement pursuant to which Cohu will acquire Xcerra for a combination of cash and stock.

UnitySC opens new Asia entity to support advanced packaging and power device markets

05/08/2018  UnitySC, a developer of advanced inspection and metrology solutions, today announced the opening of its Asia subsidiary, Unity Semiconductor Limited Company (UnitySC Asia).

CMOS image sensor sales stay on record-breaking pace

05/08/2018  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, and other new uses will offset slow growth in camera phones, says new report.

Semtech announces acquisition of IC Interconnect

05/07/2018  Semtech Corporation, a supplier of high performance analog, mixed-signal semiconductors and advanced algorithms, today announced it has acquired substantially all the assets of IC Interconnect, Inc.

Global semiconductor packaging materials market tops $16B

05/07/2018  The global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers -- the industry’s traditional drivers -- is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018.

Making automotive smart: Key takeaways from SEMI Taiwan Member Forum

05/03/2018  Emboldened by advances in self-driving and Internet of Vehicles (IoV) technologies, Taiwan’s microelectronics sector is investing heavily in manufacturing processes and equipment as engines of innovation and growth for autonomous driving, the world’s next market goldmine. But breaking into the self-driving vehicle industry can be an uphill struggle.

ALLVIA adds capabilities for through-quartz vias

05/02/2018  To meet growing market demand for high-density 2.5D and 3D stacked semiconductor solutions, Silicon Valley-based ALLVIA, Inc. has expanded its in-house capabilities to include the formation of through-quartz vias (TQV) ranging from 15 microns in diameter and 100 microns deep to 50 microns in diameter and 250 microns deep.

EV Group begins construction of new Manufacturing III building

05/02/2018  EV Group today announced that it has started construction work for the next expansion phase of its corporate headquarters.

TowerJazz announces release of advanced 300mm 65nm BCD power management platform

05/02/2018  TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.

Mentor enhances tool portfolio for TSMC 5nm FinFET and 7nm FinFET Plus processes and wafer-on-wafer stacking technology

05/01/2018  Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC's 5nm FinFET and 7nm FinFET Plus processes.

Cadence collaborates with TSMC to advance 5nm and 7nm+ mobile and HPC design innovation

05/01/2018  Cadence Design Systems, Inc. today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms.

TSMC certifies Synopsys Design platform for high-performance 7nm FinFET Plus technology

04/30/2018  Synopsys, Inc. today announced certification of the Synopsys Design Platform with TSMC's latest Design Rule Manual (DRM) for advanced 7nm FinFET Plus process technology.

Spin Transfer Technologies announces breakthrough MRAM technology for SRAM and DRAM applications

04/30/2018  Spin Transfer Technologies, Inc. announced results of its unique Precessional Spin Current (PSC) structure.

Samsung begins mass production of 10nm-class 16Gb LPDDR4X DRAM for automobiles

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.

Barbara Humpton named Siemens U.S. CEO

04/26/2018  Siemens Corporation today announced that Barbara Humpton has been appointed CEO for the United States, effective June 1, 2018.

Turning graphene into light nanosensors

04/26/2018  Tuning the graphene embedded in a photonic crystal by varying the external temperature can transform it into a light-sensitive sensor.

Arbe Robotics selects GlobalFoundries for its high-res imaging radar

04/26/2018  Arbe Robotics' proprietary chipset leverages GF's 22FDX technology to deliver industry's first real-time 4D imaging radar for level 4 and 5 autonomous driving.

TSMC continues to dominate the worldwide foundry market

04/25/2018  Top eight companies held 88% of global foundry market last year.

Global expansion at more subdued pace

04/25/2018  Most key countries/regions saw a slowdown in growth in March based on their respective Purchasing Managers Indices. And in one case – South Korea – manufacturing moved into contraction.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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