08/02/2012 

Unisem named Lee Hoong Leong as group COO, replacing Ang Chye Hock, who has retired. Lee brings experience from UTAC, STATS ChipPAC, TI, and National Semiconductor.

08/01/2012 

Park Electrochemical plans to cease operations at its Nelco Technology (Zhuhai FTZ) Ltd. facility in Zhuhai, China. Nelco products include microwave and RF component substrates, printed circuit materials, and advanced substrates such as BT.

08/01/2012 

FlipChip International (FCI), wafer-level packaging and flip chip bumping provider, named Weng Kay Lui as Asian sales director, overseeing sales for, among other areas, FCI's recently expanded FlipChip Millennium (Shanghai).

07/31/2012 

Mesuro, semiconductor testing and services provider, raised

07/31/2012 

LED encapsulants are closely related to the LED’s lifespan and light transmittance. With high-power and high-brightness LEDs emerging, the encapsulant’s role is becoming more important, says Displaybank.

07/31/2012 

Cascade Microtech introduced the modular MPS150 manual wafer probe station with six application-specific test packages for RF, mmW, and I-V/C-V measurement; failure analysis; and high-power device characterization.

07/30/2012 

Henkel Electronic Materials added LOCTITE ABLESTIK CDF 200P to its conductive die attach film offering. The pre-cut film is available in 150mm and 200mm diameter sizes for easy wafer-form matching. The film is both a dicing tape and die attach tape.

07/30/2012 

CGI Americas is introducing the QMO Series inert gas and vacuum ovens and MOL Series Class 100 cleanroom ovens, based on the SMO Series precision ovens from C Sun, to the North American market.

07/27/2012 

EMCORE, compound semiconductor-based components and subsystems supplier, will replace multiple legacy manufacturing systems in its compound semiconductor fab and back-end packaging operations with the Camstar Enterprise Platform.

07/27/2012 

Dr. Phil Garrou, contributing editor, shares Nanya Technology

07/27/2012 

Cascade Microtech Inc. (NASDAQ:CSCD), supplier of wafer-level measurement instruments for ICs, held its first Innovation Awards Ceremony to honor inventors, authors and other innovators at the company.

07/26/2012 

ASM Pacific Technology Limited noted in its H1 2012 results a record level of orders for leadframes in Q2. It also delivered what it calls the largest leadframe packaging set up to date.

07/25/2012 

SEMI Europe will host a new event, the European 3D TSV Summit, January 22-23, 2013 in Grenoble, France. This inaugural meeting will revolve around the theme: "On the Road towards TSV Manufacturing," denoting how device designers and manufacturers are crossing from 2D packaging to 3D for more functionality in a smaller form factor.

07/25/2012 

STATS ChipPAC appointed Gary Tanner as a member to its Board of Directors. Tanner brings experience from Zarlink Semiconductor, Intel, Texas Instruments, and other semiconductor companies.

07/24/2012 

Global Semiconductor Alliance (GSA) recently named Jay Esfandyari, STMicroelectronics, as its MEMS Working Group chairman and Ken Potts, Cadence Design Systems, as the 3D IC Working Group chairman.

07/20/2012 

IPC and JPCA released their first operational-level standard for the printed electronics industry, defining terms and establishes basic requirements for substrate materials used in printed electronics: ceramic, organic, metal, glass and other.

07/20/2012 

"Following seven months of increases, the three-month average bookings declined in June and likely reflects some slowing in investment plans attributed to weaknesses in the broader economy," said Denny McGuirk, SEMI.  "While order activity may slow, equipment spending this year will continue to be directed towards advanced technologies in wafer processing and packaging assembly."

07/19/2012 

3D TSV chips will represent 9% of the total semiconductors value in 2017, according to Yole D

07/18/2012 

Kyocera Industrial Ceramics Corporation, Chemical Sales Division introduced the environmentally friendly XKE-G5633 Epoxy Molding Compound (EMC) for BGA and LGA package encapsulation.

07/18/2012 

STATS ChipPAC presented its annual Supplier Awards to its top supplier partners for their excellent performance and outstanding support in 2011. Supplies are scored on technology, quality, delivery, responsiveness, service, and cost competiveness criteria.