07/18/2012 

IC Insights’ latest survey and ranking of the major semiconductor capital spenders shows that only 6 of the 35 major semiconductor suppliers -- Intel, Samsung, Hynix, TSMC, UMC, and Rohm -- with significant capital expenditure budgets are expected to spend more in 2012 than they did in 2011.

07/17/2012 

SEMI's Collaborative Alliance for Semiconductor Test released a Docking and Mounting Generic Terminology Guideline document that can be used to improve the

07/17/2012 

Ziptronix Inc., which develops direct bonding technology for advanced semiconductor applications, has licensed its technology for a high-volume cellular handset application.

07/16/2012 

Sonoscan introduced a simulator software, SonoSimulator, that enables stacked die makers to check nondestructively for delaminations between layers. SonoSimulator software is now a standard feature on the Gen6 C-SAM acoustic microscope.

07/16/2012 

Jennifer Wrigley and Robert Bellinger, Olympus, share insights on SEMICON West

07/13/2012 

Nordson MARCH uncrated the FasTRAK Plasma System at SEMICON West. The automated, high-throughput vacuum plasma treatment system processes leadframe strips, laminate substrates, and other strip-type microelectronic components.

07/13/2012 

At SEMICON West, the working groups of the International Technology Roadmap for Semiconductors (ITRS) outlined 2012 updates to the roadmap. Check out the back-end process info here.

07/13/2012 

At the ITRS 2012 update, back-end technologies session, at SEMICON West, roadmapping for More than Moore was addressed as both a philosophical and technical matter.

07/12/2012 

SEMICON West’s Day 2 keynote speaker represented a fabless company: Ivo Bolsens, PhD, SVP and CTO of Xilinx presented on how programmable chips and innovative packaging can advance semiconductors.

07/12/2012 

CEA-Leti presented research updates alongside SEMICON West this week. After the talks on device architecture, 3D and 2.5 packaging interconnects, large-scale computing and power consumption, and more, CEA-Leti’s researchers joined Solid State Technology to talk about their fields of interest.

07/12/2012 

After meeting with various semiconductor manufacturing tool suppliers -- Applied Materials, KLA-Tencor, Lam Research, Tokyo Electron, Teradyne and Cymer -- at SEMICON West, Citi analysts share impressions on foundry spending plans and tool choices.

07/11/2012 

The MiQro Innovation Collaborative Centre (C2MI) is improving its state-of-the-art MEMS facility with Eyelit Manufacturing software to support R&D and the commercial activities of sponsor companies. C2MI is also installing a suite of new wafer processing tools from SPTS Technologies.

07/11/2012 

In this video interview, Intel's Shekhar Borkar shares some key topics from SEMICON West keynote: Near-threshold voltage transistor designs, 3D integration for DRAM, unconventional interconnect, and more.

07/11/2012 

SEMATECH qualified EVG's GEMINI automated wafer bonding system through its Equipment Maturity Assessment implemented within SEMATECH's 3D Interconnect program and ISMI's EMA team.

07/11/2012 

Michael A. Fury, Ph.D., reports on the opening day of SEMICON West (July 10), covering exaflop computing, FDSOI, TSV and other integration schemes, and silicon photonics with CEA-Leti.

07/11/2012 

MicroProbe introduced current-carrying capability of >1A/probe in 90

07/10/2012 

The bulk of packaging falls under the

07/10/2012 

Luc Van den hove, president and CEO, imec, spoke with Solid State Technology, covering imec’s major announcements and research presentations to take place during SEMICON West 2012.

07/10/2012 

Semiconductor equipment sales will reach $42.4 billion in 2012, according to the mid-year edition of the SEMI Capital Equipment Forecast, released at SEMICON West 2012.

07/10/2012 

SUSS MicroTec uncrated the third generation of the ACS200 Coating and Developing Platform, developed from the company’s ACS200Plus and Gamma platforms for a compact, highly precise MEMS, LED, and related fab tool.