Packaging

PACKAGING ARTICLES


Xilinx relies on stacked silicon interconnect for 28Gbps FPGA

05/31/2012 

Xilinx Inc. (NASDAQ:XLNX) began shipping a 3D heterogeneous all-programmable FPGA, the Virtex-7 H580T FPGA, using its stacked silicon interconnect (SSI) technology to reach up to 16 28Gbps and 72 13.1Gbps transceiver bandwidth.
AT&S cuts embedded package design time by 40% with Mentor Graphics

05/31/2012 

Mentor Graphics collaborated with Austria Technologie & Systemtechnik (AT&S) to implement AT&S Embedded Component Package (ECP) process in Mentor Graphics
Ziptronix wafer stacking tech expands to 3D memory devices

05/30/2012 

Ziptronix Inc. is helping a 3D memory device maker replace standard die stacking with its DBI wafer-stacking technology, which has been proven in image sensor packaging.
New Japan Radio implements Cu wire bonding for power semiconductors

05/30/2012 

New Japan Radio Co. Ltd. adopted Tanaka Denshi Kogyo KK
IC package revenues outgrow unit shipments through 2016

05/29/2012 

Increased demand for product functionality is driving up IC packaging revenue faster -- a 9.8% compound annual growth rate (CAGR) -- than IC unit growth -- 7.3% CAGR 2010-2016, says New Venture Research (NVR).
Semiconductor packaging house orders 14 Rudolph Technologies inspection tools

05/29/2012 

Rudolph Technologies Inc. will deliver 14 NSX Series 320 inspection systems to a large outsourced semiconductor assembly and test (OSAT) provider.
Process Watch: The dangerous disappearing defect

05/29/2012 

In this first installment of a series called "Process Watch,” experts from KLA-Tencor explain why a defect might be classified as “Not Found” or “SEM Non-visual (SNV),” and how a SNV count can disguise or hide real problems.

ASE opens Phase 3 semiconductor packaging and test facility in Weihai

05/29/2012 

Advanced Semiconductor Engineering Incorporated (ASE) opened its Phase 3 manufacturing facility in Weihai, Shangdong province, China, boosting discrete packaging and test capacity.
Top suppliers of semiconductor assembly and test equipment: VLSIresearch survey

05/25/2012 

THE BEST rankings from VLSIresearch identify the highest-rated suppliers of wafer processing, assembly, and test equipment. The top 2 test equipment suppliers were just fractions apart in the rankings.
MEMS Symposium Report: Chasing 1 Trillion

05/24/2012 

The 10th Annual MEMS Technology Symposium sponsored by MEPTEC (MicroElectronics Packaging and Test Engineering Council) was held May 23 at the San Jose Holiday Inn. This year’s theme was “Sensors: A Foundation for Accelerated MEMS Market Growth to $1 Trillion.”

Direct chip bonding, all-SiC design increase power density in Mitsubishi Electric inverter

05/23/2012 

Mitsubishi Electric Corporation developed a prototype forced-air-cooled three-phase 400V output inverter with all-silicon carbide (SiC) power modules and direct lead bonding that has a power density of 50kVA per liter.
APNT's new thermal interface materials meet power semiconductors' reqs

05/23/2012 

Applied Nanotech Holdings Inc. uncrated the THERCOBOND family of highly thermally conductive bonding and printed materials for power electronics and photonics packaging.
Indium expands electronics materials manufacturing with new facility in NY

05/23/2012 

Indium Corporation acquired a manufacturing facility in Rome, NY, to expand its production capacities of indium-, gallium-, germanium-, and tin-based materials, as well as other compounds.
Invensas debuts high-I/O PoP semiconductor packaging design

05/22/2012 

Invensas Corporation, Tessera subsidiary, debuted bond via array (BVA) technology, an ultra-high-I/O PoP semiconductor packaging alternative to wide-I/O TSV packaging.
Dow Electronic Materials promotes Muni to direct advanced packaging products

05/21/2012 

Bhavesh Muni took the helm as global business director for the Advanced Packaging Technologies business of Dow Electronic Materials, covering Dow's semiconductor packaging materials product portfolio and its manufacturing capabilities.
Amkor plans semiconductor packaging and test facility in Korea

05/19/2012 

Amkor Technology Inc. (NASDAQ:AMKR) plans to build a state-of-the-art factory and global research and development center in the Incheon Free Economic Zone, which is located in the greater metropolitan area of Seoul, Korea.
IC packaging substrates heading for $8.67B in 2012

05/18/2012 

In 2012, the global IC substrate market will reach a value of USD8.67 billion, according to Research in China
Silicon Labs offers bare die from 1 wafer and up

05/16/2012 

Mixed-signal IC maker Silicon Laboratories Inc. (NASDAQ: SLAB) introduced a microcontroller (MCU) die sales program with a minimum order quantity of 1 wafer.
Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

05/16/2012 

The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.
Kulicke & Soffa expands Singapore HQ, bolsters bonder tool R&D and manufacturing

05/16/2012 

Kulicke & Soffa broke ground on its Singapore global headquarters expansion, near the current leased headquarters location. A state-of-the-art facility in Serangoon will bolster the company



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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