Packaging

PACKAGING ARTICLES


DRIE expands from MEMS to advanced packaging and more applications

05/15/2012 

"3.5D interposer technology could someday replace PCBs" -- TSMC's Doug Yu

05/15/2012 

TSMC
Heraeus Al-clad Cu bonding wire avoids metallization changes in power semiconductors

05/14/2012 

Heraeus introduced its high-reliability composite aluminum/copper (CucorAl) semiconductor bonding wire, which offers strong mechanical and electrical bonds to semiconductor pads, with good thermal properties.
ASMPT integrates European business with SIPLACE organization

05/14/2012 

Asia-based ASM Pacific Technology (ASMPT) Group, a supplier of semiconductor assembly, bonding, and packaging equipment, will integrate with the SIPLACE organization in Europe.
CMOS image sensor suppliers ramp up 300mm capacity

05/11/2012 

CMOS image sensors (CIS) are breaking sales records again, after several years without upward momentum, reports IC Insights. New portable systems and embedded imaging are lifting CIS to $6.3 billion in 2012 and new record sales each year through 2016.
FormFactor knocked off semiconductor probe card podium

05/07/2012 

Sales of semiconductor probe cards grew 17% in 2011, reaching $1.17 billion, VLSIresearch reports. While short of a record, 2011 was one of the probe card sector
Camtek ships semiconductor inspection tools to leading US IDM

05/07/2012 

A leading, US-based IDM ordered about $5 million of front- and back-end semiconductor automatic optical inspection (AOI) tools from Camtek Ltd.
SATS provider Carsem begins LED packaging and test

05/04/2012 

Semiconductor packaging and test services provider Carsem will assemble and test LED packages, partnering with a key customer and applying semiconductor packaging technologies for better LEDs.
Micropelt raises EUR6.5M for wafer-based energy harvesting technology

05/03/2012 

Micropelt has raised EUR6.5 million for the roll-out and global expansion of its thin-film thermoelectric energy harvesting technology: EUR5 million by Ludgate Environmental Fund (LEF); EUR1 million from the MUCAP; and EUR0.5 million by the existing shareholders IBG/Goodvent, KfW, L-Bank and SHS.
GaN Systems collaborates with APEI to optimize power electronics packaging

05/03/2012 

GaN Systems and Arkansas Power Electronics International will co-develop a high-temperature, high-performance package optimized for gallium nitride (GaN) transistors and diodes.
David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012

05/03/2012 

Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. David, the Senior Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York, will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain.
Nitto Denko transfers semiconductor encapsulant business to Hitachi Chemical

05/03/2012 

Nitto Denko Corporation approved a transfer of its semiconductor encapsulating materials business to Hitachi Chemical Co. Ltd.
High-power semiconductor test contactor hits 500 Amperes

05/03/2012 

Multitest introduced the ecoAmp Kelvin contactor for high-power device test of 500+ Amperes. It meets the needs of high voltage/high current test with high thermal and mechanical stability.
Top OSATS raise 2012 capex with semiconductor test focus

05/01/2012 

The top three outsourced semiconductor assembly and test services (OSATS) providers raised 2012 capex during their earnings reports, from initial plans announced in January, report analysts at Citi.
Interposer consortium ready to expand at Georgia Tech PRC

04/26/2012 

After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center is beginning Phase 2 in June.
GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die

04/26/2012 

At its Fab 8, GLOBALFOUNDRIES is installing a special set of production tools to create TSV in 20nm wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics.
SEMATECH highlights from VLSI-TSA

04/26/2012 

SEMATECH experts reported on innovative processes for advanced CMOS logic and memory device technologies and 3D TSV manufacturing at the International VLSI Technology, System and Applications Symposium (VLSI-TSA).
One-piece jetting cartridge for semiconductor packaging inspired by ink jet designs

04/25/2012 

Nordson ASYMTEK uncrated the NexJet System for jetting, with a newly designed jet cartridge and new software control for semiconductor packaging applications.
NXP increases pad pitch while shrinking package form factor

04/24/2012 

NXP Semiconductors released the new SOT1226 "Diamond" package using a

EoPlex builds packaging facility in Malaysia

04/24/2012 

EoPlex Limited, a subsidiary of ASTI Holdings Limited, Singapore, will open a new factory for its xLC semiconductor package technology in Q2 2012, in Malaysia.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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