Packaging

PACKAGING ARTICLES


NEXX Systems bolsters employee skills with new grant

02/23/2012 

Present at coolingZONE LED 2012 in Berlin

02/23/2012 

coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, and related topics.
ISSCC round-up: 2.5D packaging for IVRs, smallest NAND flash chip, more

02/22/2012 

International Solid-State Circuits Conference (ISSCC) is going on now, gathering semiconductor design and device architecture presentations from research firms like imec to chip companies like IBM. Here are some highlighted presentations.
Chip substrate factory begins producing thermal-control substrates in Russia

02/22/2012 

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.
Present at ESTC 2012 in Amsterdam

02/21/2012 

Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more.
Amkor plans IMAPS Device Packaging keynote

02/21/2012 

The 2012 IMAPS Device Packaging Conference will take place March 6-8 in Fountain Hills, AZ, with Amkor's Dr. Robert Darveaux presenting "Escalating Challenges in Developing Complex Solutions for Next Generation Package and Interconnect Technologies."
Join iNEMI's electronics manufacturing supply chain workshop at IPC APEX

02/17/2012 

iNEMI will hold the industry kick-off for its 2013 Roadmap in an open workshop immediately following IPC APEX EXPO in San Diego, CA, March 1-2.
Shin-Etsu Chemical releases low-RI LED encapsulants

02/17/2012 

Shin-Etsu Chemical Co. Ltd.'s new KER-7000 Series silicone encapsulating materials offer a low (1.38) refractive index (RI) for HB-LED packaging with lower gas permeability and higher transparency.
Semiconductor industry expectations for 2012: Take the WWK survey

02/17/2012 

Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.
Georgia Tech produces 130um 3D organic semiconductor package

02/16/2012 

Georgia Tech
Universities: Enter to win a Finetech die bonder

02/15/2012 

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges.
Hesse & Knipps opens wedge bonder demo lab on West Coast

02/15/2012 

Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.
LEDs, power semiconductors packaged with high-thermal-conductivity die attach adhesives

02/15/2012 

Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for LEDs and small power semiconductor die packaging.
CMOS image sensors keep pushing CCDs out of the picture

02/13/2012 

CMOS image sensors in 2011 continued to push CCD sensors into a smaller, isolated section of the market. CMOS image sensors are growing on use in mobile electronics and emerging applications, shows analyst firm IHS, and will find more adoption as back-side illumination costs come down.
European microelectronics fab database tracks major changes over past 5 years

02/13/2012 

Yole Developpement released "European Microelectronic Fabs Database & Report 2012," a database and report on the European microelectronics and microsystem manufacturing fabs, pilot lines, and major R&D organizations.
Amkor continues cost reductions with voluntary retirement in Japan

02/10/2012 

Amkor (NASDAQ:AMKR) shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.
Theta Delta's burn-in & long-term semiconductor testers gain Core Wafer Systems technologies

02/09/2012 

Theta Delta will incorporate Core Wafer Systems technologies into its burn-in test and long-term reliability test systems for semiconductors. Core Wafer Systems provides parallel measurement schema for semiconductor test.
Synova Laser MicroJet wafer dicing tools to be made by Makino

02/09/2012 

Synova SA formed an OEM agreement with its partner Makino Milling Machine Co. Ltd., wherein Makino will manufacture Laser MicroJet (LMJ) tools based on Synova technology.
2011 ITRS: DRAM, 3D Flash, MEMS, nano scaling steal the show

02/08/2012 

The 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. Several areas of advancement are highlighted in the 2011 ITRS: DRAM and Flash memory, and MEMS.
SATS providers order BTU reflow ovens in Asia

02/08/2012 

BTU International Inc. won multiple orders for PYRAMAX solder reflow ovens from semiconductor assembly and test subcontractors (SATS) in Asia.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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