Packaging

PACKAGING ARTICLES


Kyocera doubles flip-chip assembly with new cleanroom in US

02/07/2012 

Kyocera America, Inc. doubled its flip chip assembly capacity for microelectronic devices with a $3.5 million Class-10,000 cleanroom, offering lead-free processes in San Diego.
Nextreme brings thin-film on-par with bulk thermoelectrics

02/06/2012 

Nextreme Thermal Solutions announced that its thin-film thermoelectric technology has achieved a 60.1°C temperature difference between its cold and hot sides at an ambient temperature of 24.7°C, bringing it on par with the performance of bulk thermoelectric technology.
Rudolph sells metrology tool for back-end wafer packaging processes

02/06/2012 

Rudolph Technologies (NASDAQ:RTEC) delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
SUSS wafer bonder/debonder features up to 6 modules in new generation

02/06/2012 

SUSS MicroTec launched the XBC300 Gen2 high-volume 3D wafer processing tool for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.
X-FAB Silicon Foundries adopts SFT software

02/03/2012 

X-FAB Silicon Foundries, a More-than-Moore semiconductor foundry, has used SFT's R3D (Resistive 3D) software for its 0.18
3M debuts high-capacitance ECM for IC packaging, RF, other apps

02/02/2012 

3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI).
Multitest launches MT9510 x16 test tool with Asian sale

02/01/2012 

Multitest launched its tri-temp 16-site pick-and-place platform, MT9510 x16, with an installation at a high-volume chip test site in Asia.
STATS ChipPAC shutters Thailand semiconductor packaging plant after floods

02/01/2012 

STATS ChipPAC decided not to resume semiconductor assembly operations in its Thailand plant, owing to extensive equipment and facility damages sustained during the disastrous floods in 2011.
CEA-Leti launches 3D semiconductor packaging platform

01/31/2012 

CEA-Leti launched a major new platform, Open 3D, that provides industrial and academic partners with a global offer of mature 3D packaging technologies for their advanced semiconductor products and research projects.
Tanaka establishes copper bonding wire production in Taiwan

01/31/2012 

Tanaka Denshi Kogyo K.K., of Tanaka Precious Metals, will establish a production subsidiary for manufacturing copper bonding wire in Taiwan, with manufacturing ramp on February 1.
Apple iPhone 4S steals smartphone show in Q4 2011; Samsung wins the year

01/27/2012 

While Apple's release of the iPhone 4S in Q4 2011 "unleashed tremendous pent-up demand" from consumers, Samsung used its broad range of smartphones to take the top spot, reports IHS.
Keithley Instruments upgrades semiconductor test software suite

01/26/2012 

Keithley Instruments Inc. upgraded the capabilities of its Automated Characterization Suite Test Environment to ACS Version 4.4. The software is used with several Keithley instrument and system configurations for automated device characterization and reliability analysis.
BSE Group achieves milestones in semiconductor equipment financing biz

01/26/2012 

Test Advantage Capital Group, a business of BSE Group, surpassed $150M in its portfolio of semiconductor manufacturing equipment under management. Boston Semi Equipment's fab equipment leasing business also received a $100M annual commitment from its financial backer, Wafra Capital Partners.
3D MID sensor fabricated with Ticona laser-activated LCP circuits

01/25/2012 

2E mechatronic GmbH & Co. KG designed a 3D molded interconnect device flow sensor that uses Ticona's Vectra E840i LDS laser-activated LCP for electronic circuits. The Vectra E840i forms circuits on 3D injection moldings produced with an LDS process.
Presto Engineering semiconductor service hub opens in Israel

01/24/2012 

Presto Engineering, integrated semiconductor test and product engineering services provider, opened its newest Hub to serve the semiconductor design community, in Israel.
USPTO seeks nominees for National Medal of Technology and Innovation

01/24/2012 

The USPTO is looking to increase the diversity of honorees for its annual National Medal of Technology and Innovation (NMTI), honoring "this nation's creative geniuses."
Si-Ware platform creates MOEMS on-wafer with lithographic alignment

01/24/2012 

Si-Ware Systems debuted the SiMOST platform to fab and package single-chip optical systems with validated MEMS components. Multiple MOEMS structures can be patterned and etched on SOI wafers using DRIE. The structures are then wafer-level packaged and diced.
CWS upgrades on-wafer accelerated reliability line for Agilent testers

01/24/2012 

Core Wafer Systems, subsidiary of Action Products International, upgraded its PDQ-WLR on-wafer accelerated reliability product line to version 7.0, designed specifically for Agilent Technologies' Parametric Testers.
Silex devs wafer-level MEMS fab technologies for mobile devices

01/23/2012 

Silex Microsystems joined Energy-efficient Piezo-MEMS Tunable RF Front-End Antenna Systems for Mobile Devices to develop TSVs, PZT thin films, and other technologies for high-performance RF systems targeting mobile devices.
Sony stacks CMOS image sensor pixel structures and chips

01/23/2012 

Sony has developed a backside-illuminated CMOS image sensor that layers the pixel section with back-illuminated structures over the chips containing signal processing circuits, instead of using supporting substrates.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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