03/06/2018  A team from EPFL and NCCR Marvel has identified more than 1,000 materials with a particularly interesting 2D structure. Their research paves the way for groundbreaking technological applications.

03/06/2018  Launch of Maja Systems terabit connectivity solutions in millimeter wave CMOS accelerated by Presto’s high-volume wireless and RF test expertise.

03/05/2018  Each year, Solid State Technology turns to industry leaders to hear viewpoints on the technological and economic outlook for the upcoming year. Read through these expert opinions on what to expect in 2018.

03/02/2018  2017 was a terrific year for SEMI members. Chip revenues closed at nearly $440B, an impressive 22 percent year- over-year growth.

03/01/2018  3D integration and packaging has challenged failure analysis (FA) techniques and workflows due to the high complexity of multichip architectures, the large variety of materials, and small form factors in highly miniaturized devices.

02/28/2018  Since 2010, 474 companies have poured $51 billion into developing products enabled by artificial intelligence (AI), with the bulk of these investments targeting autonomous driving and in-vehicle experiences, according to the McKinsey reports.

02/27/2018  Co-developed technology solution enables significant power and die size reductions for IoT and wearable products.

02/23/2018  Super Micro Computer, Inc. today announced that it has expanded its Silicon Valley Headquarters to over two million square feet of facilities with the grand opening of its new Building 22.

02/22/2018  Technology trail-blazers explore business insights, new technologies, integration strategies at co-located events, held February 12-15, 2018 in Monterey, CA.

02/22/2018  2017 finished on an upturn – both in the USA and globally. Based on consolidated fourth-quarter actual and estimated revenues of 213 large, global electronic manufactures, sales rose in excess of 7 percent in 4Q’17 vs. 4Q’16.

02/21/2018  Despite increasing costs of development, IC manufacturers are still making great strides.

02/21/2018  Nordson Corporation announces that the SEMI Foundation has appointed Joseph Stockunas, Corporate Vice President for Electronics Systems at Nordson Corporation and the immediate past chair of the SEMI North America Advisory Board, to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

02/20/2018  Qualcomm Incorporated today announced that Qualcomm River Holdings B.V. has reached an agreement with NXP Semiconductors N.V.

02/16/2018  Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

02/15/2018  Siemens announced it has entered into an agreement to acquire Oulu, Finland-based Sarokal Test Systems Oy.

02/14/2018  Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each other’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.

02/14/2018  STMicroelectronics today announced it has signed an agreement on LDMOS RF power technology from Innogration Technologies, a fabless semiconductor company headquartered in Suzhou, China.

02/13/2018  CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".

02/12/2018  MagnaChip Semiconductor Corporation announced today it now offers the 2nd generation of 0.13 micron BCD process technology integrated with high-density embedded Flash memory.

02/09/2018  Samsung Electronics Co., Ltd. today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.