01/23/2018  Micron Technology, Inc. today launched the Micron 5200 series of SATA solid state drives.

01/18/2018  Numerous smaller deals were made but "megadeals" were scarce last year.

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

01/17/2018  Everspin Technologies, Inc., a developer and manufacturer of discrete and embedded MRAM, today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018

01/17/2018  ASML Holding N.V. (ASML) today announces that the Supervisory Board intends to appoint Roger Dassen as Executive Vice President and Chief Financial Officer (CFO) to the Board of Management.

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

01/12/2018  The lawsuit covers three areas that allegedly infringe upon UMC’s patent rights in China, including specific memory applications that relate to DDR4, SSD and memory used in graphics cards.

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

01/09/2018  GLOBALFOUNDRIES and STMicroelectronics today announced that ST has selected GF's 22nm FD-SOI (22FDX) technology platform to support its next-generation of processor solutions for industrial and consumer applications.

01/08/2018  Micron and Intel today announced an update to their successful NAND joint development partnership that has helped the companies develop and deliver industry-leading NAND technologies to market.

01/08/2018  With integration complete, FOA is managed as a Special Interest Group (SIG) within SEMI. FOA member companies will become full SEMI members, with FOA continuing to expand its global membership through SEMI's global network, while maintaining its unique community.

01/08/2018  Odyssey Technical Solutions today announced that they have reached agreement with COMET PCT (Plasma Control Technologies) division, located in San Jose, CA. with headquarters in Switzerland, to stock and exclusively distribute the COMET vacuum capacitor line of components for North, Central and South America.

01/04/2018  From the Internet of Things to the cloud to artificial intelligence, industries are seeing a new wave of technologies that have the potential to transform and significantly impact the world around us.

01/04/2018  Nordson Corporation has acquired Sonoscan, Inc., an Elk Grove Village, Illinois-based designer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems used in a variety of microelectronic, automotive, aerospace and industrial electronics assembly applications.

01/04/2018  Two Chinese companies -- HiSilicon and Unigroup -- are among the top 10 fabless IC sales leaders.

01/03/2018  The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion.

12/22/2017  The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.

12/21/2017  The Korea Advanced Back-end Factory Integration Task Force, in response to the industry's demand, has decided to revise SEMI E142-0211 (Reapproved 1016), Specification for Substrate Mapping by adding an assembly and packaging raw materials traceability method.

12/20/2017  Samsung Electronics Co., Ltd. announced today that it has begun mass producing the industry’s first 2nd-generation of 10-nanometer class (1y-nm), 8-gigabit (Gb) DDR4 DRAM.

12/19/2017  EPC2049 GaN power transistor offers power systems designers a 40 V, 5 m? power transistor about 8 times smaller than equivalently rated silicon MOSFETs for point of load converters, LiDAR, and low inductance motor drive.