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PACKAGING ARTICLES



Enabling the A.I. era

11/08/2017  There’s a strongly held belief now that the way in which semiconductors will be designed and manufactured in the future will be largely determined by a variety of rapidly growing applications, including artificial intelligence/deep learning, virtual and augmented reality, 5G, automotive, the IoT and many other uses, such as bioelectronics and drones. The key question for most semiconductor manufacturers is how can they benefit from these trends?

The intelligence that leads to artificial intelligence

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.

2017 sees advances in connected devices, memory

11/07/2017  The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.

How to solve the BEOL RC delay problem?

11/07/2017  The RC delay issues started a few nodes ago, and the problems are becoming worse.

Broadcom proposes to acquire Qualcomm

11/06/2017  The Broadcom proposal stands whether Qualcomm's pending acquisition of NXP Semiconductors N.V. is consummated on the currently disclosed terms of $110 per NXP share or the transaction is terminated.

NXP and Chongqing establish center for automotive electronics applications development in China

11/03/2017  NXP has partnered with the Chongqing Economic and Information Technology Commission and the Chongqing Laingian New Area Administrative Committee to drive more automotive industry growth with the new applications development center.

Embedded FPGAs offer SoC flexibility

11/01/2017  With mask costs rising and the need for flexibility growing, companies are beginning to adopt embedded field programmable gate arrays in their SoC designs.

Global semiconductor industry posts highest-ever quarterly sales

11/01/2017  The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached $107.9 billion for the third quarter of 2017, marking the industry’s highest-ever quarterly sales and an increase of 10.2 percent compared to the previous quarter.

Deep-depletion: A new concept for MOSFETs

10/26/2017  An international team of researchers has created a proof of concept that uses the deep-depletion regime in bulk-boron-doped diamond MOSFETs to increase hole channel carrier mobility.

NVIDIA, Taiwan's Ministry of Science and Technology to accelerate Taiwan AI revolution with NVIDIA AI computing platform

10/26/2017  NVIDIA today announced that it is collaborating with Taiwan's Ministry of Science and Technology (MOST) to accelerate the development of artificial intelligence across Taiwan's commercial sector in support of its recently announced AI Grand Plan to help foster domestic AI-related industries.

Piezoelectrics stretch their potential with a method for flexible sticking

10/25/2017  Researchers see performance boost in novel method for connecting thin-film piezoelectric materials to flexible substrates, with potential applications for medical devices.

Wafer-level packaging device shipments to overtake flip chip tech in 2018

10/24/2017  The number of IC packages utilizing wafer-level packaging (WLP) will overtake flip chip shipments in 2018 and then continue growing at a compound annual growth rate of 15% (between 2014 and 2020) compared to just 5% for flip chip, according to the report recently published by The Information Network.

Nanotube fiber antennas as capable as copper

10/23/2017  Rice University researchers show their flexible fibers work well but weigh much less.

GlobalFoundries' momentum in China

10/23/2017  Company shares details of technology roadmap and customer adoption in the world’s fastest-growing market for semiconductors.

Microsemi launches Mi-V ecosystem to accelerate adoption of RISC-V

10/19/2017  The announcement comes as the company also introduces Mi-V RV32IMA and additional field programmable gate array (FPGA)-based soft CPU solutions ideally suited for designs utilizing RISC-V open instruction set architectures (ISAs).

IC Insights raises 2017 IC market forecast to +22%

10/19/2017  Strong growth to be driven by a 74% surge in the DRAM market and 44% jump in the NAND flash market.

ASE, Amkor and JCET expected to top TrendForce's revenue ranking of OSAT providers for 2017

10/18/2017  The annual revenue from the global IC testing and packaging industry for 2017 is estimated to grow by 2.2% to reach US$51.73 billion, according to the latest research from TrendForce.

Samsung completes qualification of 8nm LPP process

10/18/2017  Samsung Electronics Co., Ltd. announced today that 8-nanometer (nm) FinFET process technology, 8LPP (Low Power Plus), has been qualified and is ready for production.

2017 IEDM features rich technical program, focus sessions

10/17/2017  Each year at the IEDM, the world's best technologists in micro/nano/bioelectronics converge to participate in a technical program consisting of more than 220 presentations, along with other events.

China IC industry outlook

10/17/2017  With an increasing presence in the global semiconductor manufacturing supply chain, the market opportunities in China are expanding dramatically.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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