08/09/2017  Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

08/08/2017  Toshiba America Electronic Components, Inc. (TAEC) announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH to deliver better transfer speeds and power efficiency.

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

08/07/2017  Cadence delivered new 7nm-ready Rapid Adoption Kits (RAKs) for the Cortex-A75 and the Cortex-A55 CPUs, which include the DynamIQ Shared Unit (DSU) that provides a shared level 3 cache between the CPUs, and a 7nm-ready RAK for the Mali-G72 GPU.

08/07/2017  Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc.

08/04/2017  NXP Semiconductors N.V. announced a $22 million dollar program that expands its operations in the United States.

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

08/01/2017  SEMICON Southeast Asia will make its debut in Kuala Lumpur, Malaysia on May 8-10 at the new Malaysia International Trade & Exhibition Centre (MITEC).

07/31/2017  TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

07/28/2017  For an increasing number of designs, companies are finding it beneficial to design their own ASICs with system-on-a- chip (SoC) complexity. For reasons of cost reduction, quality improvement, IP protection and security, a full turn-key ASIC can be achieved for $1-5 million, particularly if the design can be built using mature technology nodes.

07/27/2017  Solid State Technology will be conducting a new survey will take aim at understanding what this evolution means to the semicon-ductor manufacturing industry supply chain in terms of the technology that will be needed.

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.

07/27/2017  Fan-out packaging is an established technology for many mobile applications. Whereas early semiconductor packages have been single-chip packages, the continuing trend of expanding the wiring surface to support increased functionality has led to more complex packages, stacked packages, systems inpackageaswellashigh-performancepackages. With this development, fan-out technology is bridging a gap between cost-competitive packaging and high performance.

07/26/2017  Issued every two years, Bosch’s coveted awards recognize companies that have demonstrated outstanding performance in the manufacture and supply of products or services to Bosch.

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

07/25/2017  Worldwide silicon wafer area shipments increased during the second quarter 2017 when compared to first quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

07/21/2017  Worldwide PC shipments totaled 61.1 million units in the second quarter of 2017, a 4.3 percent decline from the second quarter of 2016, according to preliminary results by Gartner, Inc.

07/21/2017  The SEMI Foundation today announced that its flagship High Tech U (HTU) program received the Innovative Program Award at the High Impact Technology Exchange Conference (HI-TEC).

07/21/2017  Atlas 0.3 mm pitch spring probe validated at customer site.