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2017 IEEE IEDM to showcase technology and device breakthroughs in logic, memory, bioelectronics, silicon photonics

07/20/2017  Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel.

SUNY Poly awarded $720,000 by U.S. Department of Energy for next-generation semiconductor research

07/20/2017  Grant from Energy Department's Advanced Research Projects Agency-Energy supports further development of cutting-edge gallium nitride-based power electronics at SUNY Poly.

Brian Crutcher joins TI board of directors

07/20/2017  Texas Instruments Incorporated today announced that Brian T. Crutcher has been named to its board of directors. Mr. Crutcher is executive vice president and chief operating officer of TI.

Taiwan largest semiconductor materials market, as SEMICON Taiwan approaches

07/19/2017  Taiwan is the world's largest consumer of semiconductor materials for the seventh consecutive year, bringing new opportunities in this increasingly critical sector.

Former Micron CEO Mark Durcan to receive semiconductor industry's top honor

07/18/2017  The Semiconductor Industry Association (SIA) announced Mark Durcan, former CEO of Micron Technology, Inc., and a longtime leader in advancing semiconductor technology, has been named the 2017 recipient of SIA's highest honor, the Robert N. Noyce Award.

2H17 DRAM, NAND ASP growth to cool, but yearly growth strong

07/18/2017  Record annual ASP growth rates forecast for both memory segments.

Hamburg researchers develop new transistor concept

07/17/2017  Transistors, as used in billions on every computer chip, are nowadays based on semiconductor-type materials, usually silicon. As the demands for computer chips in laptops, tablets and smartphones continue to rise, new possibilities are being sought out to fabricate them inexpensively, energy-saving and flexibly.

GLOBALFOUNDRIES and VeriSilicon to enable single-chip solution for next-gen IoT networks

07/14/2017  Integrated solution leverages GF's 22FDX technology to decrease power, area, and cost for NB-IoT and LTE-M applications.

PLAT4M matures three silicon photonic platforms

07/14/2017  Leti today announced that the European FP7 project PLAT4M has now been completed with results that exceeded expectations.

Semiconductor content in electronic systems forecast to set new record in 2017

07/14/2017  Semiconductor content expected to reach 28.1% this year, breaking previous high of 25.9% set in 2010.

Applied Materials announces 2017 Supplier of the Year Awards

07/14/2017  Applied Materials, Inc. today recognized 10 companies with Supplier of the Year Awards for their contributions to Applied's success over the past year.

ASM International launches Intrepid epitaxy tool

07/13/2017  ASM International introduced the Intrepid ES 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.

Digital revolution: The path to innovation is opened by disruption

07/13/2017  Digital disruption begets innovation. Challenges equal opportunities.

SEMI Awards honor process and technology integration achievements

07/13/2017  SEMI announced the recipients of the 2017 SEMI Awards for the Americas.

Standards industry leaders honored at SEMICON West 2017

07/12/2017  SEMI honored four industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced at the SEMI International Standards reception held during SEMICON West 2017.

$49.4B semiconductor equipment forecast: New record, Korea at top

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

How low can we go?

07/11/2017  In the advanced CMOS technology programs ongoing in the Belgium city of Leuven, imec works to extend the building-blocks of integrated circuits (IC).

Meniscus-assisted technique produces high efficiency perovskite PV films

07/10/2017  A new low-temperature solution printing technique allows fabrication of high-efficiency perovskite solar cells with large crystals intended to minimize current-robbing grain boundaries.

SUNY Poly-led AIM Photonics and NY-Power Electronics Manufacturing Consortium to highlight research, collaboration at SEMICON West 2017

07/06/2017  Prominent New York State Tech Pavilion and Nanotech Summit at SEMICON West Exhibition to showcase innovation-based business growth opportunities

Busch COBRA BC achieves 12 year milestone at GlobalFoundries Fab 1

06/29/2017  Twelve years of continuous operation amounts to over 18.9 billion rotations.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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